Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films
文献类型：会议论文
| 作者 | Jinqi Xie; Zhe Zhong; Kai Zhang; Matthew M.F. Yuen; S.W. Ricky Lee; Xianzhu Fu; Rong Sun; Ching Ping Wong |
| 出版日期 | 2016 |
| 会议名称 | The 17th International Conference on electronic packing Technology (ICEPT 2016) |
| 会议地点 | Changsha,China |
| 英文摘要 | Electroplating is used here to fabricate a SnAgCu eutectic solders coating on copper substrate. The optimized coating is composed of Sn, Ag and Cu with the weight ratio of 96.4:3.0:0.6. Its melting temperature was confirmed at 215-220 oC. The coating thickness was controlled at 10 μm and its thermal conductivity reaches up to 56.7 W/mK. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10115]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Jinqi Xie,Zhe Zhong,Kai Zhang,et al. Electroplating Fabrication and Characterization of Sn-Ag Eutectic Solder Films[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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