Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles
文献类型：会议论文
| 作者 | Yankang Han; Baotan Zhang; Pengli Zhu; Shulei Huang; Qianqian Liu; Rong Sun |
| 出版日期 | 2016 |
| 会议名称 | The 17th International Conference on electronic packing Technology (ICEPT 2016) |
| 会议地点 | Changsha,China |
| 英文摘要 | In this paper, Ag nano-particles (Ag-NPs) with size of 50 nm, good stability and dispersion have been prepared via the tradition polyol method. Then, a small amount of this prepared nanosized Ag particles combined with the common used Ag micro-flake (Ag-MFs) were used as the conductive fillers to fabricate the isotropic electrically conductive adhesive (ICA). The content of the Ag-NPs on the electrical properties of the ICAs have been studied systematically. It is showed that, only a small amount of Ag-NPs, much lower than literature reported previously, can dramatically improve the electrical conductivity of the ICA based on Ag-MFs. The results indicated that for the 80wt% Ag-MFs filled ICA, after introducing 0.24wt% Ag-NPs, the volume resistivity of the samples could be reduced from 1.14 ×10-3 Ω·cm to 1.37×10-4 Ω·cm. ICA made by above method with the 70wt % Ag fillers have excellent overall performance with higher shear strength of 26.35 Mpa and a lower volume resistivity of 8.00x10-4 Ω·cm, which was considered to be an ideal ICA candidate for electronic packaging applications. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10121]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Yankang Han,Baotan Zhang,Pengli Zhu,et al. Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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