Novel Underfill Material Having Low Coefficeint of Thermal Expansione
文献类型：会议论文
| 作者 | Zhang Baotan; Sun Rong; Zhu Pengli |
| 出版日期 | 2016 |
| 会议名称 | The 17th International Conference on electronic packing Technology (ICEPT 2016) |
| 会议地点 | Changsha,China |
| 英文摘要 | The novel underfill material with low coefficient of thermal expansion was prepared by cyanate, epoxy, polyimide and silica filler. Rheological properties, curing behaviors, mechanical and thermal properties of the resultant materials were investigated by rheometer, DSC, FTIR, TMA and DMA, respectively. The results showed that the modification of cyanate resin and its copolymer with silica filler has high fluidity for capillary underfill application. With an increase in silica fillers loading, the coefficient of thermal expansion reduces from 68.2 to 19.5 ppm/℃at 70 wt% silica fillers at room temperature, while the glass transition temperature of cured material is greater than 230 ℃. This indicates that the novel underfill material has good dimensional stability and thermal stability, which can be used for high density flip chip interconnection assembly. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/10126]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2016 |
| 推荐引用方式 GB/T 7714 | Zhang Baotan,Sun Rong,Zhu Pengli. Novel Underfill Material Having Low Coefficeint of Thermal Expansione[C]. 见:The 17th International Conference on electronic packing Technology (ICEPT 2016). Changsha,China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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