Study of effects of differential via on signal integrity
文献类型：期刊论文
| 作者 | Wang, Dalong; Wu, Zhengbin; Wang, Jian |
| 刊名 | Advanced Materials Research
 |
| 出版日期 | 2013 |
| 英文摘要 | If characteristic impedance along a transmission line mismatch on a printed circuit board, high-speed signal has serious signal integrity problems. When signalpath of a differential pair jumps layers, mismatched impedance between differential via and differential line will affect the signal integrity. The models of a coupled transmission line and via are presented in this paper. Impedance matching of the coupled transmission line and differential via for differential signals is studied. The effects of differential via dimensions on differential signals is simulated and analyzed. |
| 收录类别 | EI |
| 原文出处 | http://www.scientific.net/AMR.805-806.1011 |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/5227]  |
| 专题 | 深圳先进技术研究院_其他 |
| 作者单位 | Advanced Materials Research |
| 推荐引用方式 GB/T 7714 | Wang, Dalong,Wu, Zhengbin,Wang, Jian. Study of effects of differential via on signal integrity[J]. Advanced Materials Research,2013. |
| APA | Wang, Dalong,Wu, Zhengbin,&Wang, Jian.(2013).Study of effects of differential via on signal integrity.Advanced Materials Research. |
| MLA | Wang, Dalong,et al."Study of effects of differential via on signal integrity".Advanced Materials Research (2013). |
入库方式： OAI收割
来源：深圳先进技术研究院
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