Multi-physics analysis of heat-structure on surface resistance
文献类型：会议论文
| 作者 | Jianxu Hu; Maozhou Meng |
| 出版日期 | 2011 |
| 会议名称 | 2011 International Conference on Information and Automation, ICIA 2011 |
| 会议地点 | Shenzhen, China |
| 英文摘要 | The failure of electronic systems and equipment mostly happens in the welding parts between components and circuit board while the cycles of thermal expansion achieve a certain number, because the solder comes to fatigue cracking. In this paper, a sample about surface resistance was chosen to explain what relationship among the electric field, heat transfer, and structure expansion by using the multi-physics modeling and simulation software, COMSOL Multiphysics, to model these three physical fields in fully coupling. The components of the electric field, temperature field and stress field distribution were extracted to explain the interaction among these three physics fields. According to the results of numerical simulation, the engineer will be inspired to obtain an optimization structure and process. |
| 收录类别 | EI |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/3592]  |
| 专题 | 深圳先进技术研究院_数字所 |
| 作者单位 | 2011 |
| 推荐引用方式 GB/T 7714 | Jianxu Hu,Maozhou Meng. Multi-physics analysis of heat-structure on surface resistance[C]. 见:2011 International Conference on Information and Automation, ICIA 2011. Shenzhen, China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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