Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics
文献类型：期刊论文
| 作者 | Jing Hongqi ; Zhong Li ; Ni Yuxi ; Zhang Junjie ; Liu Suping ; Ma Xiaoyu |
| 刊名 | journal of semiconductors
 |
| 出版日期 | 2016 |
| 卷号 | 36期号:10页码:102006 |
| 学科主题 | 半导体器件 |
| 收录类别 | SCI |
| 公开日期 | 2017-03-16 |
| 源URL | [http://ir.semi.ac.cn/handle/172111/27944]  |
| 专题 | 半导体研究所_半导体集成技术工程研究中心 |
| 推荐引用方式 GB/T 7714 | Jing Hongqi,Zhong Li,Ni Yuxi,et al. Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics[J]. journal of semiconductors,2016,36(10):102006. |
| APA | Jing Hongqi,Zhong Li,Ni Yuxi,Zhang Junjie,Liu Suping,&Ma Xiaoyu.(2016).Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics.journal of semiconductors,36(10),102006. |
| MLA | Jing Hongqi,et al."Design and simulation of a novel high-efficiency cooling heat-sink structure using fluid-thermodynamics".journal of semiconductors 36.10(2016):102006. |
入库方式： OAI收割
来源：半导体研究所
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