中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Optimization for solid polymer microstructure replication using gas-assisted hot embossing under low pressure

文献类型:期刊论文

作者Wan, L; Zhu, N; Li, X; Zhang, RY(张瑞英); Mei, T
刊名INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING
出版日期2016
卷号17期号:8
通讯作者Mei, T
英文摘要In order to realize the replication of high-quality polymer microstructures with vertical and smooth sidewalls, a gas-assisted hot embossing process with low pressure supplied was optimized to eliminate the swallowtail phenomenon during pattern transfer and simplify workpiece process setting. With help of passive alignment clamp, the rate of replication greater than 95.5% for vertical sidewalls was successfully obtained under the optimum process condition. Accordingly, a root mean square sidewall roughness of 4.6 nm was measured for polymer trenches in comparison with that of 5.7 nm for the silicon mold using a bevel-cut preparation technique. Furthermore, the rate of bulging of less than 15% for polymer workpiece was also obtained. The experiment has demonstrated that high-precise polymer pattern replication is related to both process settings and mold morphology sizes.
关键词[WOS]FABRICATION ; MICROFABRICATION ; ALIGNMENT ; FILMS
收录类别SCI ; EI
语种英语
WOS记录号WOS:000380669000010
源URL[http://ir.sinano.ac.cn/handle/332007/4691]  
专题苏州纳米技术与纳米仿生研究所_纳米器件及相关材料研究部_董建荣团队
推荐引用方式
GB/T 7714
Wan, L,Zhu, N,Li, X,et al. Optimization for solid polymer microstructure replication using gas-assisted hot embossing under low pressure[J]. INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING,2016,17(8).
APA Wan, L,Zhu, N,Li, X,Zhang, RY,&Mei, T.(2016).Optimization for solid polymer microstructure replication using gas-assisted hot embossing under low pressure.INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING,17(8).
MLA Wan, L,et al."Optimization for solid polymer microstructure replication using gas-assisted hot embossing under low pressure".INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING 17.8(2016).

入库方式: OAI收割

来源:苏州纳米技术与纳米仿生研究所

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