Wafer-Level Light Emitting Diode (WL-LED) Chip Simplified Package for Very-High Power Solid-State Lighting (SSL) Source
文献类型：期刊论文
| 作者 | Zhang, YB; Xu, JW; Ding, MD; Zhao, DS; Huang, HJ; Lu, GJ; Miao, ZL; Qi, YD; Zhang, BS(张宝顺); Cai, Y(蔡勇) |
| 刊名 | IEEE ELECTRON DEVICE LETTERS
 |
| 出版日期 | 2016 |
| 卷号 | 37期号:2 |
| 通讯作者 | Cai, Y(蔡勇) |
| 英文摘要 | A simplified packaging process was successfully developed for a wafer-level light emitting diode (WL-LED) chip aiming at very-high power solid-state lighting (SSL) applications. Compared with the traditional chip-on-board (COB) technology, WL-LED chip not only greatly simplifies the packaging process but also enables the lighting source more compact. The fabricated blue WL-LED SSL source with a record-high light output power of 305 W exhibits similar to 30% wall plug efficiency at an input electrical power of 1026 W. |
| 关键词[WOS] | OUTPUT POWER ; GAN |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000370432000019 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/4551]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_纳米器件及相关材料研究部_张宝顺团队 |
| 推荐引用方式 GB/T 7714 | Zhang, YB,Xu, JW,Ding, MD,et al. Wafer-Level Light Emitting Diode (WL-LED) Chip Simplified Package for Very-High Power Solid-State Lighting (SSL) Source[J]. IEEE ELECTRON DEVICE LETTERS,2016,37(2). |
| APA | Zhang, YB.,Xu, JW.,Ding, MD.,Zhao, DS.,Huang, HJ.,...&Cai, Y.(2016).Wafer-Level Light Emitting Diode (WL-LED) Chip Simplified Package for Very-High Power Solid-State Lighting (SSL) Source.IEEE ELECTRON DEVICE LETTERS,37(2). |
| MLA | Zhang, YB,et al."Wafer-Level Light Emitting Diode (WL-LED) Chip Simplified Package for Very-High Power Solid-State Lighting (SSL) Source".IEEE ELECTRON DEVICE LETTERS 37.2(2016). |
入库方式： OAI收割
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。