Interfacial structure and stability in Ni/SKD/Ti/Ni skutterudite thermoelements
文献类型:期刊论文
作者 | Shi, Lanfang1,2; Huang, Xiangyang1; Gu, Ming1; Chen, Lidong3,4 |
刊名 | SURFACE & COATINGS TECHNOLOGY |
出版日期 | 2016-01-15 |
卷号 | 285页码:312-317 |
关键词 | Intermetallics Electroplating Thermal stability Joining Interfaces Diffusion |
英文摘要 | Ni/Ti/SKD/Ni (SKD: skutterudite) thermoelements were fabricated by spark plasma sintering and electroplating procedures. The interfacial stability was evaluated by long-term isothermal aging and multi-round thermal shock tests. The interfacial diffusion at Ni/SKD and Ni/Ti in the thermoelements during high temperature aging up to 15 days was systematically studied by scanning electron microscopy with elemental distribution. The growth kinetics of the intermetallic compounds was analyzed, and the coefficients of the intermetallic compound growth rate were calculated. For the Ni/SKD interface, there was no inter-diffusion at temperatures below 200 degrees C. However, three intermetallic compound layers for the Ti/Ni interface were confirmed to be TiNi3, TiNi and Ti2Ni sequentially from the Ni side to the Ti side at temperatures above 500 degrees C, leading to an interfacial structure of Ti/Ti2Ni/TiNi/TiNi3/Ni. All interfaces maintained good bonding strength after long-term isothermal aging and multi-round thermal shock tests. The experimental data demonstrated that Ni is an ideal candidate as the electrode of skutterudite thermoelements at both the hot and cold sides. (C) 2015 Elsevier B.V. All rights reserved. |
WOS标题词 | Science & Technology ; Technology ; Physical Sciences |
类目[WOS] | Materials Science, Coatings & Films ; Physics, Applied |
研究领域[WOS] | Materials Science ; Physics |
关键词[WOS] | HIGH-TEMPERATURE ; THERMOELECTRIC JOINTS ; INTERMETALLIC COMPOUNDS ; RELIABILITY EVALUATION ; EVOLUTION ; SOLDER ; MODULE ; SUBSTRATE ; FIGURE ; MERIT |
收录类别 | SCI |
语种 | 英语 |
WOS记录号 | WOS:000369200600037 |
源URL | [http://ir.sic.ac.cn/handle/331005/23265] |
专题 | 上海硅酸盐研究所_高性能陶瓷和超微结构国家重点实验室_期刊论文 |
作者单位 | 1.Chinese Acad Sci, Shanghai Inst Ceram, Key Lab Mat Energy Convers, 1295 Dingxi Rd, Shanghai 200050, Peoples R China 2.Chinese Acad Sci, Grad Univ, 19 Yuquan Rd, Beijing 100049, Peoples R China 3.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, 1295 Dingxi Rd, Shanghai 200050, Peoples R China 4.Shanghai Inst Mat Genome, Shanghai, Peoples R China |
推荐引用方式 GB/T 7714 | Shi, Lanfang,Huang, Xiangyang,Gu, Ming,et al. Interfacial structure and stability in Ni/SKD/Ti/Ni skutterudite thermoelements[J]. SURFACE & COATINGS TECHNOLOGY,2016,285:312-317. |
APA | Shi, Lanfang,Huang, Xiangyang,Gu, Ming,&Chen, Lidong.(2016).Interfacial structure and stability in Ni/SKD/Ti/Ni skutterudite thermoelements.SURFACE & COATINGS TECHNOLOGY,285,312-317. |
MLA | Shi, Lanfang,et al."Interfacial structure and stability in Ni/SKD/Ti/Ni skutterudite thermoelements".SURFACE & COATINGS TECHNOLOGY 285(2016):312-317. |
入库方式: OAI收割
来源:上海硅酸盐研究所
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