The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects
文献类型：期刊论文
| 作者 | Qi, Qian1,2; Liu, Yan1; Zhang, Hui1; Zhao, Jing1; Gai, Linlin1,2; Huang, Zhengren1 |
| 刊名 | ADVANCED ENGINEERING MATERIALS
 |
| 出版日期 | 2016-08-01 |
| 卷号 | 18期号:8页码:1504-1510 |
| 英文摘要 | The TiC/Ni-Cr composites are promising candidates for IT-SOFC interconnects. In this paper, the TiC/Ni-Cr composites are fabricated by pressureless infiltration, and in order to increase the contiguity of TiC, the partial in situ method and isothermal heat treatment are used. The results show that with the increase of in situ TiC from 10 (TG1) to 20 wt% (TG2), the thermal expansion (CTE) decreases by 0.1 x 10(-6) degrees C-1, and electrical resistivity (sigma) decreases from 5.23 x 10(-3) to 1.59 x 10(-3) Omega cm and from 2.23 x 10(-3) to 0.93 x 10(-3) Omega cm with isothermal heat treatment. By contrast, the isothermal heat treatment at 1 300 degrees C for 20 min can nearly doubly increase the contiguity of TiC. The CTE shows decrease by 0.4 x 10(-6) degrees C-1, and (s decreases from 5.23 x 10(-3) to 2.23 x 10(-3) Omega cm in TG1 and from 1.59 x 10(-3) to 0.93 x 10(-3) Omega cm in TG2. |
| WOS标题词 | Science & Technology ; Technology |
| 类目[WOS] | Materials Science, Multidisciplinary |
| 研究领域[WOS] | Materials Science |
| 关键词[WOS] | ALUMINUM-MATRIX COMPOSITES ; SIC PARTICLES ; MICROSTRUCTURE ; BEHAVIOR ; CONDUCTIVITY |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000382984300022 |
| 源URL | [http://ir.sic.ac.cn/handle/331005/22832]  |
| 专题 | 上海硅酸盐研究所_结构陶瓷与复合材料工程研究中心_期刊论文 |
| 作者单位 | 1.Chinese Acad Sci, Shanghai Inst Ceram, State Key Lab High Performance Ceram & Superfine, Shanghai 200050, Peoples R China 2.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Qi, Qian,Liu, Yan,Zhang, Hui,et al. The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects[J]. ADVANCED ENGINEERING MATERIALS,2016,18(8):1504-1510. |
| APA | Qi, Qian,Liu, Yan,Zhang, Hui,Zhao, Jing,Gai, Linlin,&Huang, Zhengren.(2016).The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects.ADVANCED ENGINEERING MATERIALS,18(8),1504-1510. |
| MLA | Qi, Qian,et al."The TiC/Ni-Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT-SOFC Interconnects".ADVANCED ENGINEERING MATERIALS 18.8(2016):1504-1510. |
入库方式： OAI收割
来源：上海硅酸盐研究所
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