中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

文献类型:会议论文

作者Lee SWR; Dai LH(戴兰宏)
出版日期2001
会议名称2001 ASME International Mechanical Engineering Congress and Exposition
会议日期November 11, 2001 - November 16, 2001
会议地点New York, NY, United states
关键词Elastic stress Shear loading Temperature cycling
中文摘要The present study is aimed at the experimental characterization of strain-rate dependent behaviour of solder materials under impulsive shear loading. In order to achieve this objective, a unique testing technique, namely, split Hopkinson torsion bar (SHTB) is employed. The solder material under investigation is 63Sn-37Pb. The experimental results indicate that the shear behavior of the solder joint is very sensitive to the strain rate and the dynamic shear strength of the solder joint is much higher than the static one.
收录类别EI
会议录American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
语种英语
ISBN号0-7918-3565-0
源URL[http://dspace.imech.ac.cn/handle/311007/60250]  
专题力学研究所_力学所知识产出(1956-2008)
推荐引用方式
GB/T 7714
Lee SWR,Dai LH. Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)[C]. 见:2001 ASME International Mechanical Engineering Congress and Exposition. New York, NY, United states. November 11, 2001 - November 16, 2001.

入库方式: OAI收割

来源:力学研究所

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