Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)
文献类型:会议论文
作者 | Lee SWR; Dai LH(戴兰宏) |
出版日期 | 2001 |
会议名称 | 2001 ASME International Mechanical Engineering Congress and Exposition |
会议日期 | November 11, 2001 - November 16, 2001 |
会议地点 | New York, NY, United states |
关键词 | Elastic stress Shear loading Temperature cycling |
中文摘要 | The present study is aimed at the experimental characterization of strain-rate dependent behaviour of solder materials under impulsive shear loading. In order to achieve this objective, a unique testing technique, namely, split Hopkinson torsion bar (SHTB) is employed. The solder material under investigation is 63Sn-37Pb. The experimental results indicate that the shear behavior of the solder joint is very sensitive to the strain rate and the dynamic shear strength of the solder joint is much higher than the static one. |
收录类别 | EI |
会议录 | American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP |
语种 | 英语 |
ISBN号 | 0-7918-3565-0 |
源URL | [http://dspace.imech.ac.cn/handle/311007/60250] |
专题 | 力学研究所_力学所知识产出(1956-2008) |
推荐引用方式 GB/T 7714 | Lee SWR,Dai LH. Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)[C]. 见:2001 ASME International Mechanical Engineering Congress and Exposition. New York, NY, United states. November 11, 2001 - November 16, 2001. |
入库方式: OAI收割
来源:力学研究所
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