Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems
文献类型：会议论文
| 作者 | Wei YG(魏悦广) ; Zhao HF; Shu SQ
|
| 出版日期 | 2005 |
| 会议名称 | 11th International Conference on Fracture 2005, ICF11 |
| 会议日期 | March 20, 2005 - March 25, 2005 |
| 会议地点 | Turin, Italy |
| 关键词 | Cohesive zones Copper thin film Different scale Elastic-Plastic FE analysis Interfacial fracture Material parameter Multi scale analysis Prediction and analysis Size effects Substrate system Thin film delamination |
| 中文摘要 | In this paper, both the cohesive zone/nonlinear bending model and the cohesive zone/plane strain elastic-plastic FE analysis model are adopted for analyzing the thin film nonlinear peeling process. Characteristics of the energy release rate are analyzed and presented. The analysis results based on both models are used to predict peeling experiment of copper thin film on the ceramic interface. Through prediction and analyses, one found that for the same experimental result, the effective simulations can be obtained based on both models, however, different material parameters are corresponded. It implies that two models are suitable for different scales. Combining the results based on both models, size effects of thin film delamination are characterized. |
| 收录类别 | EI |
| 会议录 | 11th International Conference on Fracture 2005, ICF11
 |
| 语种 | 英语 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/60282]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Wei YG,Zhao HF,Shu SQ. Multiscale analysis for interfacial fractures of ductile thin film/ceramic substrate systems[C]. 见:11th International Conference on Fracture 2005, ICF11. Turin, Italy. March 20, 2005 - March 25, 2005. |
入库方式： OAI收割
来源：力学研究所
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