Dynamic behaviors of mode III interfacial crack under a constant loading rate
文献类型:期刊论文
作者 | Chen SH(陈少华)![]() ![]() |
刊名 | Continuum Mechanics and Thermodynamics
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出版日期 | 2010 |
卷号 | 22期号:6-8页码:515-530 |
通讯作者邮箱 | chenshaohua72@hotmail.com |
关键词 | Mode Iii Interfacial Crack Constant Loading Rate Subsonic Supersonic Daughter Crack Simulating Materials Failure Worlds Fastest Computer Intersonic Shear Cracks One Billion Atoms Bimaterial Interface Transient Analysis Variable Velocity Homogeneous Media Transition Waves Phase-Transition |
ISSN号 | 0935-1175 |
通讯作者 | Chen SH |
合作状况 | 国际 |
中文摘要 | In an earlier study on intersonic crack propagation, Gao et al. (J. Mech. Phys. Solids 49: 2113-2132, 2001) described molecular dynamics simulations and continuum analysis of the dynamic behaviors of a mode II dominated crack moving along a weak plane under a constant loading rate. The crack was observed to initiate its motion at a critical time after the onset of loading, at which it is rapidly accelerated to the Rayleigh wave speed and propagates at this speed for a finite time interval until an intersonic daughter crack is nucleated at a peak stress at a finite distance ahead of the original crack tip. The present article aims to analyze this behavior for a mode III crack moving along a bi-material interface subject to a constant loading rate. We begin with a crack in an initially stress-free bi-material subject to a steadily increasing stress. The crack initiates its motion at a critical time governed by the Griffith criterion. After crack initiation, two scenarios of crack propagation are investigated: the first one is that the crack moves at a constant subsonic velocity; the second one is that the crack moves at the lower shear wave speed of the two materials. In the first scenario, the shear stress ahead of the crack tip is singular with exponent -1/2, as expected; in the second scenario, the stress singularity vanishes but a peak stress is found to emerge at a distance ahead of the moving crack tip. In the latter case, a daughter crack supersonic with respect to the softer medium can be expected to emerge ahead of the initial crack once the peak stress reaches the cohesive strength of the interface. |
类目[WOS] | Thermodynamics ; Mechanics |
研究领域[WOS] | Thermodynamics ; Mechanics |
关键词[WOS] | SIMULATING MATERIALS FAILURE ; WORLDS FASTEST COMPUTER ; INTERSONIC SHEAR CRACKS ; ONE BILLION ATOMS ; BIMATERIAL INTERFACE ; TRANSIENT ANALYSIS ; VARIABLE VELOCITY ; HOMOGENEOUS MEDIA ; TRANSITION WAVES ; PHASE-TRANSITION |
收录类别 | SCI |
资助信息 | Ministry of Education of China, NSFC [10972220, 10732050, 10721202]; CAS [KJCX2-YW-M04] |
原文出处 | http://www.springerlink.com/content/p45x0756l7341733/ |
语种 | 英语 |
WOS记录号 | WOS:000282698300007 |
公开日期 | 2011-03-01 ; 2011-03-30 |
源URL | [http://dspace.imech.ac.cn/handle/311007/43463] ![]() |
专题 | 力学研究所_非线性力学国家重点实验室 |
通讯作者 | Chen SH |
推荐引用方式 GB/T 7714 | Chen SH,Gao HJ,Chen SH. Dynamic behaviors of mode III interfacial crack under a constant loading rate[J]. Continuum Mechanics and Thermodynamics,2010,22(6-8):515-530. |
APA | 陈少华,高华健,&Chen SH.(2010).Dynamic behaviors of mode III interfacial crack under a constant loading rate.Continuum Mechanics and Thermodynamics,22(6-8),515-530. |
MLA | 陈少华,et al."Dynamic behaviors of mode III interfacial crack under a constant loading rate".Continuum Mechanics and Thermodynamics 22.6-8(2010):515-530. |
入库方式: OAI收割
来源:力学研究所
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