High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology
文献类型:会议论文
作者 | Yu, Dongshan1; Liang, Xuejie1; Wang, Jingwei1; Li, Xiaoning1; Nie, Zhiqiang2; Liu, Xingsheng1,2 |
出版日期 | 2017 |
会议名称 | novel in-plane semiconductor lasers xvi 2017 |
会议日期 | 2017-01-30 |
会议地点 | san francisco, ca, united states |
卷号 | 10123 |
英文摘要 | a novel marco channel cooler (macc) has been developed for packaging high power diode vertical stacked (hpdl) lasers, which eliminates many of the issues in commercially-available copper micro-channel coolers (mcc). the macc coolers, which do not require deionized water as coolant, were carefully designed for compact size and superior thermal dissipation capability. indium-free packaging technology was adopted throughout product design and fabrication process to minimize the risk of solder electromigration and thermal fatigue at high current density and long pulse width under qcw operation. single macc unit with peak output power of up to 700w/bar at pulse width in microsecond range and 200w/bar at pulse width in millisecond range has been recorded. characteristic comparison on thermal resistivity, spectrum, near filed and lifetime have been conducted between a macc product and its counterpart mcc product. qcw lifetime test (30ms 10hz, 30% duty cycle) has also been conducted with distilled water as coolant. a vertical 40-macc stack product has been fabricated, total output power of 9 kilowatts has been recorded under qcw mode (3ms, 30hz, 9% duty cycle). © 2017 spie. |
收录类别 | EI ; ISTP |
产权排序 | 1 |
会议录 | novel in-plane semiconductor lasers xvi
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会议录出版者 | spie |
语种 | 英语 |
ISSN号 | 0277786x |
ISBN号 | 9781510606876 |
源URL | [http://ir.opt.ac.cn/handle/181661/29028] ![]() |
专题 | 西安光学精密机械研究所_炬光科技有限公司 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
作者单位 | 1.Focuslight Technologies Inc, No. 56 Zhangba liu Road, High-Tech Zone, Xi'an, Shaanxi; 710077, China 2.State Key Laboratory of Transient Optics and Photonics, Xi'an Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, Xi'an Hi-Tech Industrial Development Zone, No. 17 Xinxi Road, New Industrial Park, Xi'an, Shaanxi; 710119, China |
推荐引用方式 GB/T 7714 | Yu, Dongshan,Liang, Xuejie,Wang, Jingwei,et al. High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology[C]. 见:novel in-plane semiconductor lasers xvi 2017. san francisco, ca, united states. 2017-01-30. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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