Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics
文献类型：期刊论文
| 作者 | Li S ; Liu XL; Li R; Su YW(苏业旺)
|
| 刊名 | INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
 |
| 出版日期 | 2017-04-01 |
| 卷号 | 110页码:305-314 |
| 关键词 | Shear deformation Adhesive layer Laminated structure Flexible electronics |
| ISSN号 | 0020-7683 |
| 中文摘要 | Flexible electronics has attracted much attention in recent years due to the favorable applications to many emerging devices. A novel laminated structure for a new-generation of flexible electronics is composed of several thin layers where the hard functional components are built glued by soft adhesives. To prevent the premature mechanical failure and to achieve the best performance of the electronics the structural design of such a laminate is of crucial importance. Accordingly it is necessary to establish an analytic model to accurately describe the mechanical behavior of the laminated structure. The available models fall into two categories: those only taking into account the normal strain-induced deformation of the soft adhesive layers and those only incorporating the shear deformation of the same layers. This paper aims to quantitatively figure out which deformation dominates. By establishing an accurate enough analytic model a significant finding is revealed that shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics while the normal strain-induced deformation is negligible. The model is Well validated by the finite element method (FEM). The effects of the membrane energy and bending energy of the soft layer are also investigated by incorporating or neglecting the shear energy. The model accurately captures the key quantities such as the strain distribution in each layer and the locations of the neutral mechanical planes of the top and bottom layers. This work is expected to provide the design guidelines for the laminated structure-based flexible electronics. (C) 2016 Elsevier Ltd. All rights reserved. |
| 类目[WOS] | Mechanics |
| 研究领域[WOS] | Mechanics |
| 关键词[WOS] | STRETCHABLE ELECTRONICS ; SANDWICH PANELS ; INTERCONNECTS ; MECHANICS ; DEVICES ; CORE ; EYE |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000397548800027 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/60564]  |
| 专题 | 力学研究所_非线性力学国家重点实验室 |
| 推荐引用方式 GB/T 7714 | Li S,Liu XL,Li R,et al. Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics[J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES,2017,110:305-314. |
| APA | Li S,Liu XL,Li R,&苏业旺.(2017).Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics.INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES,110,305-314. |
| MLA | Li S,et al."Shear deformation dominates in the soft adhesive layers of the laminated structure of flexible electronics".INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES 110(2017):305-314. |
入库方式： OAI收割
来源：力学研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。