Glass wafers bonding via Diels-Alder reaction at mild temperature
文献类型：期刊论文
| 作者 | Zhang MJ ; Zhao HY ; Gao LX |
| 刊名 | sensors and actuators a-physical
 |
| 出版日期 | 2008 |
| 卷号 | 141期号:1页码:213-216 |
| 关键词 | SILICON-ON-INSULATOR MICROFLUIDIC CHIPS TECHNOLOGIES FABRICATION SYSTEM FILMS LAYER MEMS |
| ISSN号 | 0924-4247 |
| 通讯作者 | gao lx |
| 中文摘要 | in this paper, we introduced a novel bonding method of glass wafers by diels-alder reaction at mild temperature. after standard hydroxylization and aminosilylation, two wafers were modified by 2-furaldehyde and maleic anhydride, respectively. then they were brought into close contact and tightly held with a clamping fixture. a strong bonding could be achieved by annealing for 5 h at 200 degrees c. bonding strength is as high as 1.78 mpa and sufficient for most application of microfluidic chips. |
| 收录类别 | SCI |
| 语种 | 英语 |
| WOS记录号 | WOS:000253390400028 |
| 公开日期 | 2010-04-14 |
| 源URL | [http://ir.ciac.jl.cn/handle/322003/11069]  |
| 专题 | 长春应用化学研究所_长春应用化学研究所知识产出_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zhang MJ,Zhao HY,Gao LX. Glass wafers bonding via Diels-Alder reaction at mild temperature[J]. sensors and actuators a-physical,2008,141(1):213-216. |
| APA | Zhang MJ,Zhao HY,&Gao LX.(2008).Glass wafers bonding via Diels-Alder reaction at mild temperature.sensors and actuators a-physical,141(1),213-216. |
| MLA | Zhang MJ,et al."Glass wafers bonding via Diels-Alder reaction at mild temperature".sensors and actuators a-physical 141.1(2008):213-216. |
入库方式： OAI收割
来源：长春应用化学研究所
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