Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling
文献类型：期刊论文
| 作者 | Gao, Li-Yin ; Liu, Zhi-Quan ; Li, Cai-Fu |
| 刊名 | JOURNAL OF ELECTRONIC MATERIALS
 |
| 出版日期 | 2017-08-01 |
| 卷号 | 46期号:8页码:5338-5348 |
| 关键词 | Fe-Ni under bump metallization (UBM) thermal cycling microstructural evolution lifetime recrystallization electron backscatter diffraction (EBSD) |
| ISSN号 | 0361-5235 |
| 通讯作者 | Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China. ; Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China. |
| 中文摘要 | Thermal cycling tests have been conducted on Sn-Ag-Cu/Fe-xNi (x = 73 wt.% or 45 wt.%) and Sn-Ag-Cu/Cu solder joints according to the Joint Electron Device Engineering Council industrial standard to study their interfacial reliability under thermal stress. The interfacial intermetallic compounds formed for solder joints on Cu, Fe-73Ni, and Fe-45Ni were 4.5 mu m, 1.7 mu m, and 1.4 mu m thick, respectively, after 3000 cycles, demonstrating excellent diffusion barrier effect of Fe-Ni under bump metallization (UBM). Also, two deformation modes, viz. solder extrusion and fatigue crack formation, were observed by scanning electron microscopy and three-dimensional x-ray microscopy. Solder extrusion dominated for solder joints on Cu, while fatigue cracks dominated for solder joints on Fe-45Ni and both modes were detected for those on Fe-73Ni. Solder joints on Fe-Ni presented inferior reliability during thermal cycling compared with those on Cu, with characteristic lifetime of 3441 h, 3190 h, and 1247 h for Cu, Fe-73Ni, and Fe-45Ni UBM, respectively. This degradation of the interfacial reliability for solder joints on Fe-Ni is attributed to the mismatch in coefficient of thermal expansion (CTE) at interconnection level. The CTE mismatch at microstructure level was also analyzed by electron backscatter diffraction for clearer identification of recrystallization-related deformation mechanisms. |
| 学科主题 | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied |
| 收录类别 | SCI |
| 资助信息 | Major National Science and Technology Program of China [2011ZX02602] |
| 语种 | 英语 |
| 公开日期 | 2017-08-17 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/78030]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Gao, Li-Yin,Liu, Zhi-Quan,Li, Cai-Fu. Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling[J]. JOURNAL OF ELECTRONIC MATERIALS,2017,46(8):5338-5348. |
| APA | Gao, Li-Yin,Liu, Zhi-Quan,&Li, Cai-Fu.(2017).Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling.JOURNAL OF ELECTRONIC MATERIALS,46(8),5338-5348. |
| MLA | Gao, Li-Yin,et al."Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling".JOURNAL OF ELECTRONIC MATERIALS 46.8(2017):5338-5348. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。