Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints
文献类型：期刊论文
| 作者 | Wang, Mingna ; Wang, Jianqiu ; Ke, Wei |
| 刊名 | MICROELECTRONICS RELIABILITY
 |
| 出版日期 | 2017-06-01 |
| 卷号 | 73页码:69-75 |
| 关键词 | Lead-free solder joint Corrosion Microstructure Solidification cracks |
| ISSN号 | 0026-2714 |
| 通讯作者 | Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China. |
| 中文摘要 | The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder joint using salt spray test. The presence of Cu pad accelerates the dissolution of Sn from solder joints into corrosive medium because of galvanic corrosion mechanism. So, the solder joint was easily corroded in corrosive environment than SAC305 solder bar. During salt spray test, pitting corrosion begin from the solidification cracks in the solder joints, which will lead to a decrease of the reliability of solder joints and shorten the life of electronic devices. (C) 2017 Elsevier Ltd. All rights reserved. |
| 学科主题 | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China (NSFC) [51601057] |
| 语种 | 英语 |
| 公开日期 | 2017-08-17 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/78103]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Wang, Mingna,Wang, Jianqiu,Ke, Wei. Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints[J]. MICROELECTRONICS RELIABILITY,2017,73:69-75. |
| APA | Wang, Mingna,Wang, Jianqiu,&Ke, Wei.(2017).Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints.MICROELECTRONICS RELIABILITY,73,69-75. |
| MLA | Wang, Mingna,et al."Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints".MICROELECTRONICS RELIABILITY 73(2017):69-75. |
入库方式： OAI收割
来源：金属研究所
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