Electromigration anisotropy introduced by tin orientation in solder joints
文献类型：期刊论文
| 作者 | Chen, Jian-Qiang ; Liu, Kai-Lang ; Guo, Jing-Dong ; Ma, Hui-Cai ; Wei, Song ; Shang, Jian-Ku |
| 刊名 | JOURNAL OF ALLOYS AND COMPOUNDS
 |
| 出版日期 | 2017-05-05 |
| 卷号 | 703页码:264-271 |
| 关键词 | Electromigration Single crystal tin Cu6Sn5 Intermetallic compounds Orientation Diffusion |
| ISSN号 | 0925-8388 |
| 通讯作者 | Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China. |
| 中文摘要 | Single-crystal Sn/Cu solder joints with (001), (101), (301) and (100) plane of Sn as the interfaces were prepared for studying the relation between orientation of Sn and electromigration. The growth of interfacial intermetallic compounds was found to strongly depend on the Sn grain orientation. When the c-axis was parallel to the current direction, a severe polarity effect was observed, while the c-axis of Sn off the current direction, the polarity effect became less pronounced. For (101) and (301) orientation samples making a 28.6 degrees and 58.6 degrees angles with c-axis of Sn, asymmetrical IMCs layer growth at the anode interface, downward sloping serrated edges of Cu dissolution groove at the cathode and granular Cu6Sn5 growth at the surface were observed, while these morphological features were not found in (001) and (100) samples making a 0 degrees and 90 degrees angles with c-axis of Sn. It is suggested that when the c-axis of beta-Sn was off the current direction, the direction of Cu atoms diffusion is shifted to the c-axis of tin grain under the electromigration driving force.(C) 2017 Elsevier B.V. All rights reserved. |
| 学科主题 | Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 资助信息 | Natural Science Foundation of China [51171191]; National key Scientific Instrument and Equipment development projects of China [2013YQ120355] |
| 语种 | 英语 |
| 公开日期 | 2017-08-17 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/78146]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Chen, Jian-Qiang,Liu, Kai-Lang,Guo, Jing-Dong,et al. Electromigration anisotropy introduced by tin orientation in solder joints[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2017,703:264-271. |
| APA | Chen, Jian-Qiang,Liu, Kai-Lang,Guo, Jing-Dong,Ma, Hui-Cai,Wei, Song,&Shang, Jian-Ku.(2017).Electromigration anisotropy introduced by tin orientation in solder joints.JOURNAL OF ALLOYS AND COMPOUNDS,703,264-271. |
| MLA | Chen, Jian-Qiang,et al."Electromigration anisotropy introduced by tin orientation in solder joints".JOURNAL OF ALLOYS AND COMPOUNDS 703(2017):264-271. |
入库方式： OAI收割
来源：金属研究所
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