Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating
文献类型：期刊论文
| 作者 | Zhao, Sheng-Sheng ; Zhao, Yan-Hui ; Cheng, Lv-Sha ; Denisov, Vladimir Viktorovich ; Koval, Nikolay Nikolaevich ; Yu, Bao-Hai ; Mei, Hai-Juan |
| 刊名 | ACTA METALLURGICA SINICA-ENGLISH LETTERS
 |
| 出版日期 | 2017-02-01 |
| 卷号 | 30期号:2页码:176-184 |
| 关键词 | Magnetic field Arc ion plating Ti-Cu-N film Residual stress Hardness |
| ISSN号 | 1006-7191 |
| 通讯作者 | Zhao, SS (reprint author), Shenzhen Polytech, Sch Mech & Elect Engn, Shenzhen 518055, Peoples R China. |
| 中文摘要 | Ti-Cu-N films were deposited on 316L stainless steel substrates by magnetic field-enhanced arc ion plating. The effect of substrate pulse bias duty cycle on the chemical composition, microstructure, surface morphology, mechanical and tribological properties of the films was systemically investigated. The results showed that, with increasing the duty cycle, Cu content decreases from 3.3 to 0.58 at.%. XRD results showed that only TiN phase is observed for all the deposited films and the preferred orientation transformed from TiN(200) to TiN(111) plane with the increase in duty cycle. The surface roughness and deposition rate showed monotonous decrease with increasing the duty cycle. The residual stress and hardness firstly increase and then decrease afterwards with the increase in duty cycle, while the variation of critical load shows reverse trend. Except for the film with duty cycle of 10%, others perform the better wear resistance. |
| 学科主题 | Metallurgy & Metallurgical Engineering |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China [51401128]; Shenzhen Science and Technology Project [JCYJ20140508155916426] |
| 语种 | 英语 |
| 公开日期 | 2017-08-17 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/78302]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Zhao, Sheng-Sheng,Zhao, Yan-Hui,Cheng, Lv-Sha,et al. Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2017,30(2):176-184. |
| APA | Zhao, Sheng-Sheng.,Zhao, Yan-Hui.,Cheng, Lv-Sha.,Denisov, Vladimir Viktorovich.,Koval, Nikolay Nikolaevich.,...&Mei, Hai-Juan.(2017).Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating.ACTA METALLURGICA SINICA-ENGLISH LETTERS,30(2),176-184. |
| MLA | Zhao, Sheng-Sheng,et al."Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating".ACTA METALLURGICA SINICA-ENGLISH LETTERS 30.2(2017):176-184. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。