中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process

文献类型:期刊论文

作者Wang Q ; He TB ; Xia P ; Chen TL ; Huang BT
刊名polymer engineering and science
出版日期1998
卷号38期号:3页码:420-428
关键词COMPOSITES CONSOLIDATION
ISSN号0032-3888
通讯作者he tb
中文摘要a numerical method to estimate temperature distribution during the cure of epoxy-terminated poly(phenylene ether ketone) (e-pek)-based composite is suggested. the effect of the temperature distribution on the selection of cure cycle is evaluated using a suggested alternation criterion. the effect of varying heating rate and thickness on the temperature distribution, viscosity distribution and distribution of the extent of cure reaction are discussed based on the combination of the here-established temperature distribution model and the previously established curing kinetics model and chemorheological model. it is found that, for a thin composite (<=10mm) and low heating rate (<=2.5k/min), the effect of temperature distribution on cure cycle and on the processing window for pressure application can be neglected. low heating rate is of benefit to reduce the temperature gradient. the processing window for pressure application becomes narrower with increasing thicknesses of composite sheets. the validity of the temperature distribution model and the modified processing window is evaluated through the characterization of mechanical and physical properties of e-pek-based composite fabricated according to different temperature distribution conditions.
收录类别SCI收录期刊论文
语种英语
WOS记录号WOS:000072904000005
公开日期2010-11-04
源URL[http://202.98.16.49/handle/322003/22993]  
专题长春应用化学研究所_长春应用化学研究所知识产出_期刊论文
推荐引用方式
GB/T 7714
Wang Q,He TB,Xia P,et al. Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process[J]. polymer engineering and science,1998,38(3):420-428.
APA Wang Q,He TB,Xia P,Chen TL,&Huang BT.(1998).Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process.polymer engineering and science,38(3),420-428.
MLA Wang Q,et al."Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process".polymer engineering and science 38.3(1998):420-428.

入库方式: OAI收割

来源:长春应用化学研究所

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