中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .4. Cure cycle simulation

文献类型:期刊论文

作者Wang Q ; He TB ; Xia P ; Chen TL ; Huang BT
刊名journal of applied polymer science
出版日期1997
卷号66期号:9页码:1751-1757
关键词FRACTURE-TOUGHNESS COMPOSITES
ISSN号0021-8995
中文摘要epoxy-terminated poly(phenylene ether ketone) (e-pek) developed in this institute is a candidate matrix resin for polymer composites as structural materials. cure cycles for this reaction system were simulated according to the previously established processing model. it is found that for the e-pek system, the curing process is best completed by a stepwise cure cycle comprising two isothermal processes at different temperatures, t-1 and t-2. the cure cycles over a wide range of processing parameters simulated, based on the established processing model, indicate that the processing window is width-adjustable. analysis of the mechanical properties of the composite sheets showed that the simulated cure cycles are acceptable and reliable. (c) 1997 john wiley & sons, inc.
收录类别SCI收录期刊论文
语种英语
公开日期2010-12-22 ; 2011-06-09
源URL[http://ir.ciac.jl.cn/handle/322003/23967]  
专题长春应用化学研究所_长春应用化学研究所知识产出_期刊论文
推荐引用方式
GB/T 7714
Wang Q,He TB,Xia P,et al. Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .4. Cure cycle simulation[J]. journal of applied polymer science,1997,66(9):1751-1757.
APA Wang Q,He TB,Xia P,Chen TL,&Huang BT.(1997).Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .4. Cure cycle simulation.journal of applied polymer science,66(9),1751-1757.
MLA Wang Q,et al."Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .4. Cure cycle simulation".journal of applied polymer science 66.9(1997):1751-1757.

入库方式: OAI收割

来源:长春应用化学研究所

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