Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .2. Chemorheological modeling
文献类型：期刊论文
| 作者 | Wang QA ; He TB ; Xia P ; Chen TL ; Huang BT |
| 刊名 | journal of applied polymer science
 |
| 出版日期 | 1997 |
| 卷号 | 66期号:4页码:799-808 |
| 关键词 | RESIN |
| ISSN号 | 0021-8995 |
| 中文摘要 | chemorheology and corresponding models for an epoxy-terminated poly(phenylene ether ketone) (e-pek) and 4,4'-diaminodiphenyl sulfone (dds) system were investigated using a differential scanning calorimeter (dsc) and a cone-and-plate rheometer. for this system, the reported four-parameter chemorheological model and modified wlf chemorheological model can only be used in an isothermal or nonisothermal process, respectively. in order to predict the resin viscosity variation during a stepwise temperature cure cycle actually used, a new model based on the combination of the four-parameter model and the modified wlf model was developed. the combined model can predict the resin viscosity variation during a stepwise temperature cure cycle more accurately than the above two models. in order to simplify the establishment of this model, a new five-parameter chemorheological model was then developed. the parameters in this five-parameter model can be determined through very few rheology and dsc experiments. this model is practicable to describe the resin viscosity variation for isothermal, nonisothermal, or stepwise temperature cure cycles accurately. the five-parameter chemorheological model has also successfully been used in the e-pek systems with two other curing agents, i.e., the diamine curing agent with the addition of a boron trifluride monoethylamine (bf3-mea) accelerator and an anhydride curing agent (hexahydrophthalic acid anhydride). (c) 1997 john wiley & sons, inc. |
| 收录类别 | SCI收录期刊论文 |
| 语种 | 英语 |
| 公开日期 | 2010-12-22 ; 2011-06-09 |
| 源URL | [http://ir.ciac.jl.cn/handle/322003/24037]  |
| 专题 | 长春应用化学研究所_长春应用化学研究所知识产出_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wang QA,He TB,Xia P,et al. Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .2. Chemorheological modeling[J]. journal of applied polymer science,1997,66(4):799-808. |
| APA | Wang QA,He TB,Xia P,Chen TL,&Huang BT.(1997).Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .2. Chemorheological modeling.journal of applied polymer science,66(4),799-808. |
| MLA | Wang QA,et al."Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .2. Chemorheological modeling".journal of applied polymer science 66.4(1997):799-808. |
入库方式： OAI收割
来源：长春应用化学研究所
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