Tailoring femtosecond 1.5-mu m Bessel beams for manufacturing high-aspect-ratio through-silicon vias
文献类型：期刊论文
| 作者 | Zhou, Changhe; Sugioka, Koji; Cheng, Ya; Chu, Wei; Tan, Yuanxin; Yu, Junjie; He, Fei |
| 刊名 | Sci Rep
 |
| 出版日期 | 2017 |
| 卷号 | 7 |
| 通讯作者 | ya.cheng@siom.ac.cn ; ksugioka@riken.jp |
| 英文摘要 | Three-dimensional integrated circuits (3D ICs) are an attractive replacement for conventional 2D ICs as high-performance, low-power-consumption, and small-footprint microelectronic devices. However, one of the major remaining challenges is the manufacture of high-aspect-ratio through-silicon vias (TSVs), which is a crucial technology for the assembly of 3D Si ICs. Here, we present the fabrication of high-quality TSVs using a femtosecond (fs) 1.5-mu m Bessel beam. To eliminate the severe ablation caused by the sidelobes of a conventional Bessel beam, a fs Bessel beam is tailored using a specially designed binary phase plate. We demonstrate that the tailored fs Bessel beam can be used to fabricate a 2D array of approximately circle divide 10-mu m TSVs on a 100-mu m-thick Si substrate without any sidelobe damage, suggesting potential application in the 3D assembly of 3D Si ICs. |
| 收录类别 | SCI |
| 资助信息 | National Natural Science Foundation of China [61327902, 11134010]; National Basic Research Program of China [2014CB921300] |
| WOS记录号 | WOS:000392185300001 |
| 源URL | [http://ir.siom.ac.cn/handle/181231/27540]  |
| 专题 | 上海光学精密机械研究所_信息光学与光电技术实验室 |
| 作者单位 | 中国科学院上海光学精密机械研究所 |
| 推荐引用方式 GB/T 7714 | Zhou, Changhe,Sugioka, Koji,Cheng, Ya,et al. Tailoring femtosecond 1.5-mu m Bessel beams for manufacturing high-aspect-ratio through-silicon vias[J]. Sci Rep,2017,7. |
| APA | Zhou, Changhe.,Sugioka, Koji.,Cheng, Ya.,Chu, Wei.,Tan, Yuanxin.,...&He, Fei.(2017).Tailoring femtosecond 1.5-mu m Bessel beams for manufacturing high-aspect-ratio through-silicon vias.Sci Rep,7. |
| MLA | Zhou, Changhe,et al."Tailoring femtosecond 1.5-mu m Bessel beams for manufacturing high-aspect-ratio through-silicon vias".Sci Rep 7(2017). |
入库方式： OAI收割
来源：上海光学精密机械研究所
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