Multilayer deformation planarization by substrate pit suturing
文献类型:期刊论文
作者 | Shao, Jianda; Cui, Yun; Chai, Yingjie; Zhu, Meiping; Xing, Huanbin; Wang, Hu |
刊名 | Opt. Lett.
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出版日期 | 2016 |
卷号 | 41期号:15页码:3403 |
通讯作者 | bree@siom.ac.cn ; jdshao@siom.ac.cn |
英文摘要 | In the pursuit of 1064 nm high-power laser resistance dielectric coatings in the nanosecond region, a group of HfO2/SiO2 high reflectors with and without suture layers were prepared on prearranged fused silica substrates with femtosecond laser pits. Surface morphology, global coating stress, and high-resolution cross sections were characterized to determine the effects of substrate pit suturing. Laser-induced damage resistance was investigated for samples with and without suture layers. Our results indicate considerable stability in terms of the nanosecond 1064 nm laser-induced damage threshold for samples having a suture layer, due to decreased electronic field (e-field) deformation with simultaneous elimination of internal cracks. In addition, a suture layer formed by plasma ion-assisted deposition could effectively improve global mechanical stress of the coatings. By effectively reducing the multilayer deformation using a suture layer, electron-beam high-reflective coatings, whose laser-induced damage resistance was not influenced by the substrate pit, can be prepared. (C) 2016 Optical Society of America |
收录类别 | SCI |
资助信息 | National Natural Science Foundation of China (NSFC) [61405225, 61505227, 61308021]; Youth Innovation Promotion Association of the Chinese Academy of Sciences (CAS) |
WOS记录号 | WOS:000381014400004 |
源URL | [http://ir.siom.ac.cn/handle/181231/28134] ![]() |
专题 | 上海光学精密机械研究所_中科院强激光材料重点实验室 |
作者单位 | 中国科学院上海光学精密机械研究所 |
推荐引用方式 GB/T 7714 | Shao, Jianda,Cui, Yun,Chai, Yingjie,et al. Multilayer deformation planarization by substrate pit suturing[J]. Opt. Lett.,2016,41(15):3403. |
APA | Shao, Jianda,Cui, Yun,Chai, Yingjie,Zhu, Meiping,Xing, Huanbin,&Wang, Hu.(2016).Multilayer deformation planarization by substrate pit suturing.Opt. Lett.,41(15),3403. |
MLA | Shao, Jianda,et al."Multilayer deformation planarization by substrate pit suturing".Opt. Lett. 41.15(2016):3403. |
入库方式: OAI收割
来源:上海光学精密机械研究所
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