中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Multilayer deformation planarization by substrate pit suturing

文献类型:期刊论文

作者Shao, Jianda; Cui, Yun; Chai, Yingjie; Zhu, Meiping; Xing, Huanbin; Wang, Hu
刊名Opt. Lett.
出版日期2016
卷号41期号:15页码:3403
通讯作者bree@siom.ac.cn ; jdshao@siom.ac.cn
英文摘要In the pursuit of 1064 nm high-power laser resistance dielectric coatings in the nanosecond region, a group of HfO2/SiO2 high reflectors with and without suture layers were prepared on prearranged fused silica substrates with femtosecond laser pits. Surface morphology, global coating stress, and high-resolution cross sections were characterized to determine the effects of substrate pit suturing. Laser-induced damage resistance was investigated for samples with and without suture layers. Our results indicate considerable stability in terms of the nanosecond 1064 nm laser-induced damage threshold for samples having a suture layer, due to decreased electronic field (e-field) deformation with simultaneous elimination of internal cracks. In addition, a suture layer formed by plasma ion-assisted deposition could effectively improve global mechanical stress of the coatings. By effectively reducing the multilayer deformation using a suture layer, electron-beam high-reflective coatings, whose laser-induced damage resistance was not influenced by the substrate pit, can be prepared. (C) 2016 Optical Society of America
收录类别SCI
资助信息National Natural Science Foundation of China (NSFC) [61405225, 61505227, 61308021]; Youth Innovation Promotion Association of the Chinese Academy of Sciences (CAS)
WOS记录号WOS:000381014400004
源URL[http://ir.siom.ac.cn/handle/181231/28134]  
专题上海光学精密机械研究所_中科院强激光材料重点实验室
作者单位中国科学院上海光学精密机械研究所
推荐引用方式
GB/T 7714
Shao, Jianda,Cui, Yun,Chai, Yingjie,et al. Multilayer deformation planarization by substrate pit suturing[J]. Opt. Lett.,2016,41(15):3403.
APA Shao, Jianda,Cui, Yun,Chai, Yingjie,Zhu, Meiping,Xing, Huanbin,&Wang, Hu.(2016).Multilayer deformation planarization by substrate pit suturing.Opt. Lett.,41(15),3403.
MLA Shao, Jianda,et al."Multilayer deformation planarization by substrate pit suturing".Opt. Lett. 41.15(2016):3403.

入库方式: OAI收割

来源:上海光学精密机械研究所

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