A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack
文献类型:期刊论文
作者 | Yi DK(易大可); Wang TC(王自强) |
刊名 | SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY |
出版日期 | 2018-06-01 |
卷号 | 61期号:6页码:64611 |
ISSN号 | 1674-7348 |
关键词 | three-dimensional fracture analysis out-of-plane constraint three-dimensional J-integral |
DOI | 10.1007/s11433-017-9138-x |
英文摘要 | In the paper, a new procedure is proposed to investigate three-dimensional fracture problems of a thin elastic plate with a long through-the-thickness crack under remote uniform tensile loading. The new procedure includes a new analytical method and high accurate finite element simulations. In the part of theoretical analysis, three-dimensional Maxwell stress functions are employed in order to derive three-dimensional crack tip fields. Based on the theoretical analysis, an equation which can describe the relationship among the three-dimensional J-integral J(z), the stress intensity factor K(z) and the tri-axial stress constraint level T-z (z) is derived first. In the part of finite element simulations, a fine mesh including 153360 elements is constructed to compute the stress field near the crack front, J(z) and T-z(z). Numerical results show that in the plane very close to the free surface, the K field solution is still valid for in-plane stresses. Comparison with the numerical results shows that the analytical results are valid. |
分类号 | 二类/Q1 |
URL标识 | 查看原文 |
WOS关键词 | SINGULAR STRESS ; ELASTIC PLATE ; FRONT ; TIP ; FRACTURE ; SHEAR |
WOS研究方向 | Physics, Multidisciplinary |
语种 | 英语 |
CSCD记录号 | CSCD:6273105 |
WOS记录号 | WOS:000428505200001 |
资助机构 | Fundamental Research Funds for the Central Universities [2014B1801] |
源URL | [http://dspace.imech.ac.cn/handle/311007/77905] |
专题 | 力学研究所_非线性力学国家重点实验室 |
作者单位 | 1.Hohai Univ, Coll Mech & Mat, Nanjing 211100, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100190, Peoples R China |
推荐引用方式 GB/T 7714 | Yi DK,Wang TC. A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack[J]. SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY,2018,61(6):64611. |
APA | Yi DK,&Wang TC.(2018).A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack.SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY,61(6),64611. |
MLA | Yi DK,et al."A new procedure for investigating three-dimensional stress fields in a thin plate with a through-the-thickness crack".SCIENCE CHINA-PHYSICS MECHANICS & ASTRONOMY 61.6(2018):64611. |
入库方式: OAI收割
来源:力学研究所
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