Phase change materials of paraffin in h-BN porous scaffolds with enhanced thermal conductivity and form stability
文献类型：期刊论文
| 作者 | Qian, Zhenchao; Shen, Heng; Fang, Xin; Fan, Liwu; Zhao, Ning; Xu, Jian |
| 刊名 | ENERGY AND BUILDINGS
 |
| 出版日期 | JAN 1 2018 |
| 卷号 | 158页码:1184-1188 |
| 英文摘要 | Low thermal conductivity and leakage after melting are the two main issues limited the application of phase change materials (PCMs). Here, to improve the thermal conductivity and hamper the leakage after melting, PCMs were fabricated by infiltrating paraffin into h-BN porous scaffolds with continuous thermal conductive paths. The latent heat of fusion of the resultant PCMs containing 18 wt% h-BN was 165.4 +/- 1.7 J/g, and the thermal conductivity was as high as 0.85 W/mK. The thermal conductivity increased approximately 600% compared to the pure paraffin, and was over twice of the composites fabricated by conventional blending of paraffin and h-BN. The enhanced thermal conductivity obviously shortened the phase change process, indicating more efficient in energy storage and release. In addition, the h-BN scaffolds endowed the PCMs shape stability under molten state and prevented the leakage of molten paraffin. This approach to fabricate form-stable PCMs with high thermal conductivity may extend to other thermal management applications. (C) 2017 Elsevier B.V. All rights reserved. |
| WOS记录号 | WOS:000428010300019 |
| 源URL | [http://ir.iccas.ac.cn/handle/121111/38864]  |
| 专题 | 化学研究所_其它 |
| 推荐引用方式 GB/T 7714 | Qian, Zhenchao,Shen, Heng,Fang, Xin,et al. Phase change materials of paraffin in h-BN porous scaffolds with enhanced thermal conductivity and form stability[J]. ENERGY AND BUILDINGS,JAN ,158:1184-1188. |
| APA | Qian, Zhenchao,Shen, Heng,Fang, Xin,Fan, Liwu,Zhao, Ning,&Xu, Jian.(JAN ).Phase change materials of paraffin in h-BN porous scaffolds with enhanced thermal conductivity and form stability.ENERGY AND BUILDINGS,158,1184-1188. |
| MLA | Qian, Zhenchao,et al."Phase change materials of paraffin in h-BN porous scaffolds with enhanced thermal conductivity and form stability".ENERGY AND BUILDINGS 158(JAN ):1184-1188. |
入库方式： OAI收割
来源：化学研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。