中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
3-D characterization of incipient spallation response in cylindrical copper under sweeping detonation

文献类型:期刊论文

作者Yang, Y; Chen, JX; Guo, ZL; Tang, TG; Hu, HB; Fu, YN
刊名JOURNAL OF MATERIALS RESEARCH
出版日期2017
卷号32期号:8页码:1499-1505
ISSN号0884-2914
DOI10.1557/jmr.2017.25
文献子类期刊论文
英文摘要The effect of peak shock stress on the incipient spallation damage in a cylindrical sample under sweeping detonation is presented. The free surface velocity curve was measured by photon Doppler velocimetry and the quantitative investigation of voids in a spalled sample was performed using X-ray computer tomography. The results revealed that the maximum volume and the mean volume of voids in the spalled sample increased with increasing shock stress. The sphericity of voids decreases with the increasing of shock stress. The rod voids were the result of the independent growth of voids along the grain boundaries in samples with lower shock stress, while the rod shaped voids in sample with higher shock stress were formed due to coalesce. The rod voids can be found in a cylindrical sample, while the voids in plate samples were in the shape of spheres or ellipsoids, and the difference of stress state induced by the curvature in the geometry of samples may be the main reason.
语种英语
WOS记录号WOS:000400595700009
源URL[http://ir.sinap.ac.cn/handle/331007/27238]  
专题上海应用物理研究所_中科院上海应用物理研究所2011-2017年
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GB/T 7714
Yang, Y,Chen, JX,Guo, ZL,et al. 3-D characterization of incipient spallation response in cylindrical copper under sweeping detonation[J]. JOURNAL OF MATERIALS RESEARCH,2017,32(8):1499-1505.
APA Yang, Y,Chen, JX,Guo, ZL,Tang, TG,Hu, HB,&Fu, YN.(2017).3-D characterization of incipient spallation response in cylindrical copper under sweeping detonation.JOURNAL OF MATERIALS RESEARCH,32(8),1499-1505.
MLA Yang, Y,et al."3-D characterization of incipient spallation response in cylindrical copper under sweeping detonation".JOURNAL OF MATERIALS RESEARCH 32.8(2017):1499-1505.

入库方式: OAI收割

来源:上海应用物理研究所

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