Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias
文献类型：会议论文
| 作者 | Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; Ching-Ping Wong |
| 出版日期 | 2017 |
| 会议地点 | Harbin, China |
| 英文摘要 | 3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. The polymer material as insulation material was fabricated by the spin-coating or spray-coating process. And the polymer insulation can relax some of the stress induced and makes the process more convenient compared with CVD. Therefore, it is the most cost effective technology for the wafer level packaging. In this study, some polymer insulation materials with different silanes are investigated comprehensively, including viscosity thixotropic index, adhesion strength, thermogravimetry analysis, differential scanning calorimetry and conformal coating. All the results show that the silane has significant effect on the adhesion strength and conformal coating. The adhesion strength is improved when the silane with nitrogen atom, and the insulation layer can be spin-coated uniformly or most filled vias when the silane with different polarity are used. |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/11855]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2017 |
| 推荐引用方式 GB/T 7714 | Qiang Liu,Guoping Zhang,Rong Sun,et al. Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias[C]. 见:. Harbin, China. |
入库方式： OAI收割
来源：深圳先进技术研究院
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