Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors
文献类型：期刊论文
| 作者 | Dexin Kong; Fengqi Yu |
| 刊名 | IEICE Electronics Express
 |
| 出版日期 | 2017 |
| 文献子类 | 期刊论文 |
| 英文摘要 | It is widely known that the inaccuracy of BJT-based CMOS temperature sensors is higher at high temperature range, which greatly limits their application. In this calibration is analyzed. Through the experiments, we discover that the cause paper, the characteristic of the error after |
| URL标识 | 查看原文 |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/12018]  |
| 专题 | 深圳先进技术研究院_医工所 |
| 作者单位 | IEICE Electronics Express |
| 推荐引用方式 GB/T 7714 | Dexin Kong,Fengqi Yu. Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors[J]. IEICE Electronics Express,2017. |
| APA | Dexin Kong,&Fengqi Yu.(2017).Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors.IEICE Electronics Express. |
| MLA | Dexin Kong,et al."Analysis of the residual error due to mechanical stress in BJT-based CMOS temperature sensors".IEICE Electronics Express (2017). |
入库方式： OAI收割
来源：深圳先进技术研究院
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