Synergistic organic/Inorganic implantable packaging using multiple parylene C and aluminum oxide film
文献类型：会议论文
| 作者 | Saisai Zhao; Ye Feng; Tianzhun Wu; Chunlei Yang |
| 出版日期 | 2017 |
| 会议日期 | 2017 |
| 会议地点 | Singapore |
| 英文摘要 | Recent research on medical implants has asked for more reliable and biocompatible hermetic packaging techniques with integrated circuits (IC). Besides, high-density multi-channel IC interconnects also become a major requirement to realize high-resolution application on electrical stimulation and recording. Previously proposed packaging methods are mostly based on wire bonding technique to bond pads on chip to pads on biocompatible ceramics substrate individually. |
| 语种 | 英语 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/12220]  |
| 专题 | 深圳先进技术研究院_医工所 |
| 作者单位 | 2017 |
| 推荐引用方式 GB/T 7714 | Saisai Zhao,Ye Feng,Tianzhun Wu,et al. Synergistic organic/Inorganic implantable packaging using multiple parylene C and aluminum oxide film[C]. 见:. Singapore. 2017. |
入库方式： OAI收割
来源：深圳先进技术研究院
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