Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak
文献类型：期刊论文
| 作者 | Wu, Yuheng1,2; Wang, Huachuang1 |
| 刊名 | Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices
 |
| 出版日期 | 2016 |
| 卷号 | 9686页码:968613 |
| 关键词 | Computer Software Cooling Heat Transfer Image Sensors Manufacture Materials Testing Optoelectronic Devices |
| ISSN号 | 0277-786X |
| DOI | 10.1117/12.2242713 |
| 文献子类 | C |
| 英文摘要 | In the use of image sensors such as CCD, CMOS and so on, the noise caused by thermal dark signal will influence the imaging results to a certain extent. Dark current noise exists in every photoelectric devices and it is directly related to the temperature. So it's a principle way that cool the image sensors' temperature to suppress the dark current noise. This article presents a kind of TEC cooling package integrated with four stages TEC, a heat sink and an insulating cavity, to meet the requirement of image sensors' refrigeration. Theoretical analysis of this cooling package was done from the view of heat transfer. The modeling and thermal simulated analysis are performed by finite element simulation analysis software ANSYS Icepak, comparing the experimental results in the conditions of different ambient temperature, different heat load and vacuumizing or filling the cavity. © 2016 SPIE. |
| 语种 | 英语 |
| WOS记录号 | WOS:000391495500037 |
| 资助机构 | Chinese Academy of Sciences, Institute of Optics and Electronics (IOE) ; The Chinese Optical Society (COS) |
| 源URL | [http://ir.ioe.ac.cn/handle/181551/8513]  |
| 专题 | 光电技术研究所_光电探测与信号处理研究室（五室） |
| 作者单位 | 1.Institute of Optics and Electronics, Chinese Academy of Sciences, Chengdu 2.610209, China 3.University of Chinese Academy of Sciences, Beijing 4.100039, China |
| 推荐引用方式 GB/T 7714 | Wu, Yuheng,Wang, Huachuang. Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak[J]. Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices,2016,9686:968613. |
| APA | Wu, Yuheng,&Wang, Huachuang.(2016).Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak.Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices,9686,968613. |
| MLA | Wu, Yuheng,et al."Simulation and analysis of image sensor's TEC cooling package based on ANSYS Icepak".Proceedings of SPIE: 8th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices 9686(2016):968613. |
入库方式： OAI收割
来源：光电技术研究所
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