中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
单点金刚石飞切KDP晶体表面质量的研究

文献类型:学位论文

作者冉钰庭
文献子类硕士
导师朱健强
关键词磷酸二氢钾晶体 Potassium Dihydrogen Phosphate 单点金刚石飞切加工 single point diamond turning 表面质量 surface quality 晶体装夹 clamping of crystal 表面缺陷估测 estimation of defect depth of surface
其他题名Study on the Surface Quality of KDP Crystals Fabricated by Single Point Diamond Turning
英文摘要惯性约束核聚变(Inertial Confinement Nuclear Fusion, ICF)的研究对新能源、国防科技及物理研究等领域的开发和利用有着重要的意义。磷酸二氢钾(Potassium Dihydrogen Phosphate, KDP)和磷酸二氘钾(Potassium Dideuterium Phosphate, DKDP)晶体是目前唯一可用作ICF系统中高功率激光倍频转换、电光开关器件的非线性光学晶体材料。单点金刚石飞切加工(Single point diamond turning, SPDT)技术因其众多的优点,已被广泛用作KDP晶体、氟化钙(CaF2)晶体等脆性光学晶体材料的加工。SPDT加工过程中,KDP晶体表面微观形貌受很多因素的影响,对加工工艺提出了较高的要求,尤其是大尺寸较高表面质量的KDP晶体的稳定加工工艺已成为国内外研究的重点。 如何控制切削过程中的晶体表面质量是研究SPDT加工KDP晶体的关键和难点,对提高ICF装置以及高功率激光系统中激光光束质量和转换效率具有现实意义。本文主要包括KDP晶体SPDT加工切削参数的分析和总结、KDP晶体飞切加工中影响晶体表面质量的环境因素的分析研究以及KDP晶体SPDT加工表面缺陷的估测的研究等三部分,从各方面研究分析了表面质量中表面粗糙度、表面波纹度和表面面形的形成和影响因素,具体研究内容和成果如下: 1、SPDT加工KDP晶体切削参数的分析和总结。本章根据晶体最小切削厚度、脆塑转变临界切削厚度和最大切削厚度的分析计算,在既往的研究上总结和完善了SPDT加工KDP晶体过程中粗加工和精加工阶段理论切削厚度的范围。另外基于KDP晶体各向异性在切削中的影响机理的分析和螺旋刻画车削实验方法的应用,总结和完善了不同种类KDP晶体飞切加工应采用的切削方向。 2、SPDT加工KDP晶体的环境因素的分析研究。本章通过对KDP晶体装夹因素和飞切温度以及切削液的供给方式进行了分析和实验,得出了优化后的环境控制方法。 3、KDP晶体SPDT加工表面缺陷的估测。本章基于KDP晶体表面轮廓和缺陷形成的理论分析,提出了利用计算晶体表面缺陷占比系数估测缺陷深度的方法,并通过实验验证了此方法的可行性。对SPDT加工KDP晶体表面缺陷深度的估测以及切削参数的选用具有重要意义。 本文基于已有SPDT加工KDP晶体切削参数的研究和晶体表面质量的理论分析方法,通过进一步分析和具体实验研究,对较高表面质量晶体的加工工艺做了进一步的完善和总结。 对SPDT加工KDP晶体高效稳定的加工工艺的确定具有重要意义。; Research into Inertial Confinement Nuclear Fusion(ICF) has an important and practical significance in developing and utilizing new energy, national defense technology, physical research and other fields. Potassium Dihydrogen Phosphate(KDP) and Potassium Dideuterium Phosphate(DKDP) are the only nonlinear optical crystal material which can be used in ICF system. Single Point Diamond Turning(SPDT) technology has been widely used as KDP crystal, calcium fluoride (CaF2) crystal and other brittle optical crystal materials processing because of its many advantages. Due to the microstructure surface morphology of KDP crystal is affected by many factors in the process of SPDT, the processing technology is put forward higher requirements. In particular, the acquisition of high surface quality of large scale KDP crystal has become the focus of research at home and abroad. How to control the quality of the crystal surface in the cutting process is the key and difficult point in the research of SPDT processing of KDP crystal. It is of practical significance to improve the laser beam quality and conversion efficiency of ICF devices and high power laser systems. This paper mainly includes three parts: the analysis and summary of the cutting parameters of SPDT processing of KDP crystal, the analysis of environmental factors which affect the surface quality of KDP crystal, and the estimation of surface defects of SPDT processing of KDP crystal. The surface roughness, surface waviness and surface shape were studied and analyzed from various aspects, and detail research contents and experiment results are as follows: 1. Analysis and summary of the cutting parameters of SPDT processing of KDP crystal. In this chapter, basing on the proceed study of the minimum cutting thickness, critical cutting thickness of brittle plastic transition and maximum cutting thickness of crystal, the range of theoretical cutting thickness in rough machining and finishing machining is summarized and improved, in the SPDT processing of KDP crystal. Basing on the analysis of the cutting mechanism of KDP crystal anisotropy and the application of the spiral turning method, the optimal fly cutting direction in SPDT processing of different kinds of KDP crystals is summarized and improved. 2. Analysis of environmental factors which affect the surface quality of KDP crystal. In this chapter, the clamping factors and the cutting temperature of KDP crystal and the supply mode of cutting fluid are analyzed and experimented, so the optimized environment control method is obtained. 3. Estimation of surface defects of SPDT processing of KDP crystal. In this chapter, based on the analysis of the formation of the surface and surface defects of KDP crystal, the method of estimating the depth of surface defects by calculating the ratio coefficient of the surface defect area is processed. And the feasibility of this method is verified by experiments. They are of great significance for the selection of cutting parameters and estimation of defect depth of surface. This paper is based on the existing cutting parameter research and the crystal surface quality theoretical analysis method in the SPDT processing of KDP crystal, through further analysis and specific experimental research, the processing technology of high surface quality crystal has been further improved and summarized. It is of great significance to form the efficient and stable processing technology of SPDT processing of KDP crystal.
学科主题光学工程
源URL[http://ir.siom.ac.cn/handle/181231/30911]  
专题中国科学院上海光学精密机械研究所
作者单位中国科学院上海光学精密机械研究所
推荐引用方式
GB/T 7714
冉钰庭. 单点金刚石飞切KDP晶体表面质量的研究[D].

入库方式: OAI收割

来源:上海光学精密机械研究所

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