Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate
文献类型：期刊论文
| 作者 | Wu, Xinzhou（吴馨洲）; Shao, Shuangshuang（邵双双）; Chen, Zheng（陈征）; Cui, Zheng（崔铮）; Chen Z(陈征) |
| 刊名 | NANOTECHNOLOGY
 |
| 出版日期 | 2017 |
| 语种 | 英语 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/5577]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_印刷电子学部_崔铮团队 |
| 通讯作者 | Chen Z(陈征) |
| 推荐引用方式 GB/T 7714 | Wu, Xinzhou,Shao, Shuangshuang,Chen, Zheng,et al. Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate[J]. NANOTECHNOLOGY,2017. |
| APA | Wu, Xinzhou,Shao, Shuangshuang,Chen, Zheng,Cui, Zheng,&陈征.(2017).Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate.NANOTECHNOLOGY. |
| MLA | Wu, Xinzhou,et al."Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate".NANOTECHNOLOGY (2017). |
入库方式： OAI收割
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