Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant
文献类型：期刊论文
| 作者 | Liu, Yuan; Dai, Jinyue; Liu, Xiaoqing; Luo, Jun; You, Shusen; Zhu, Jin; Ma, Songqi; Jia, Zhen |
| 刊名 | JOURNAL OF ELECTRONIC PACKAGING
 |
| 出版日期 | 2017 |
| 卷号 | 139期号:3页码:31006 |
| ISSN号 | 1043-7398 |
| 英文摘要 | In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4'-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (H-1-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 degrees C and higher residues at 800 degrees C than that of DGEBA. |
| 公开日期 | 2017-12-25 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/13663]  |
| 专题 | 2017专题 |
| 推荐引用方式 GB/T 7714 | Liu, Yuan,Dai, Jinyue,Liu, Xiaoqing,et al. Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant[J]. JOURNAL OF ELECTRONIC PACKAGING,2017,139(3):31006. |
| APA | Liu, Yuan.,Dai, Jinyue.,Liu, Xiaoqing.,Luo, Jun.,You, Shusen.,...&Jia, Zhen.(2017).Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant.JOURNAL OF ELECTRONIC PACKAGING,139(3),31006. |
| MLA | Liu, Yuan,et al."Bio-Based Epoxy Resins Derived From Eugenol With Low Dielectric Constant".JOURNAL OF ELECTRONIC PACKAGING 139.3(2017):31006. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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