Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers
文献类型：期刊论文
| 作者 | Dong, Chaofang; Yi, Pan; Xiao, Kui; Ding, Kangkang; Li, Xiaogang |
| 刊名 | MATERIALS
 |
| 出版日期 | 2017 |
| 卷号 | 10期号:2页码:137 |
| ISSN号 | 1996-1944 |
| 英文摘要 | The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied. Results showed that, under the bias voltage of 12 V, the reverse migration of ions occurred. For PCB-Cu, both copper dendrites and sulfate precipitates were found on the surface of FR-4 (board material) between two plates. Moreover, the Cu dendrite was produced between the two plates and migrated toward cathode. Compared to PCB-Cu, PCB-ENIG exhibited a higher tendency of ECM failure and suffered from seriously short circuit failure under high relative humidity (RH) environment. SKP results demonstrated that surface potentials of the anode plates were greater than those of the cathode plates, and those potentials of the two plates exhibited a descending trend as the RH increased. At the end of the paper, an electrochemical migration corrosion failure model of PCB was proposed. |
| 公开日期 | 2017-12-25 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/14005]  |
| 专题 | 2017专题 |
| 推荐引用方式 GB/T 7714 | Dong, Chaofang,Yi, Pan,Xiao, Kui,et al. Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers[J]. MATERIALS,2017,10(2):137. |
| APA | Dong, Chaofang,Yi, Pan,Xiao, Kui,Ding, Kangkang,&Li, Xiaogang.(2017).Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers.MATERIALS,10(2),137. |
| MLA | Dong, Chaofang,et al."Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers".MATERIALS 10.2(2017):137. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。