中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference

文献类型:期刊论文

作者Xiao, Kui; Gao, Xiong; Yan, Lidan; Yi, Pan; Zhang, Dawei; Dong, Chaofang; Wu, Junsheng; Li, Xiaogong
刊名CHEMICAL ENGINEERING JOURNAL
出版日期2018
卷号336页码:92-101
关键词Thin Electrolyte Layer Raman-spectroscopy Relative-humidity Ion concentratIon Chloride Media Copper Behavior Alloys Silver H2s
英文摘要The climate in Turpan is perennial drought with little rainfall, which usually results in the corrosion of metals. This weak corrosion can cause the paralysis of electronic components in service conditions. To study the corrosion mechanism associated with copper-clad plate (PCB-Cu) in a dry-heat desert environment, Turpan (China) was elected as an outdoor exposure site. The morphologies of the PCB-Cu and the composition of the corrosion products were analyzed. In addition, the corrosion behavior of PCB-Cu in a simulated indoor environment was also investigated. The results showed that the corrosion morphology was halo-shaped in the initial corrosion stage, which was attributed to water condensation on dust due to the large diurnal temperature difference of the environment.
学科主题Engineering
语种英语
公开日期2018-12-04
源URL[http://ir.nimte.ac.cn/handle/174433/16757]  
专题2018专题
推荐引用方式
GB/T 7714
Xiao, Kui,Gao, Xiong,Yan, Lidan,et al. Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference[J]. CHEMICAL ENGINEERING JOURNAL,2018,336:92-101.
APA Xiao, Kui.,Gao, Xiong.,Yan, Lidan.,Yi, Pan.,Zhang, Dawei.,...&Li, Xiaogong.(2018).Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference.CHEMICAL ENGINEERING JOURNAL,336,92-101.
MLA Xiao, Kui,et al."Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference".CHEMICAL ENGINEERING JOURNAL 336(2018):92-101.

入库方式: OAI收割

来源:宁波材料技术与工程研究所

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