Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference
文献类型:期刊论文
作者 | Xiao, Kui; Gao, Xiong; Yan, Lidan; Yi, Pan; Zhang, Dawei; Dong, Chaofang; Wu, Junsheng; Li, Xiaogong |
刊名 | CHEMICAL ENGINEERING JOURNAL
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出版日期 | 2018 |
卷号 | 336页码:92-101 |
关键词 | Thin Electrolyte Layer Raman-spectroscopy Relative-humidity Ion concentratIon Chloride Media Copper Behavior Alloys Silver H2s |
英文摘要 | The climate in Turpan is perennial drought with little rainfall, which usually results in the corrosion of metals. This weak corrosion can cause the paralysis of electronic components in service conditions. To study the corrosion mechanism associated with copper-clad plate (PCB-Cu) in a dry-heat desert environment, Turpan (China) was elected as an outdoor exposure site. The morphologies of the PCB-Cu and the composition of the corrosion products were analyzed. In addition, the corrosion behavior of PCB-Cu in a simulated indoor environment was also investigated. The results showed that the corrosion morphology was halo-shaped in the initial corrosion stage, which was attributed to water condensation on dust due to the large diurnal temperature difference of the environment. |
学科主题 | Engineering |
语种 | 英语 |
公开日期 | 2018-12-04 |
源URL | [http://ir.nimte.ac.cn/handle/174433/16757] ![]() |
专题 | 2018专题 |
推荐引用方式 GB/T 7714 | Xiao, Kui,Gao, Xiong,Yan, Lidan,et al. Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference[J]. CHEMICAL ENGINEERING JOURNAL,2018,336:92-101. |
APA | Xiao, Kui.,Gao, Xiong.,Yan, Lidan.,Yi, Pan.,Zhang, Dawei.,...&Li, Xiaogong.(2018).Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference.CHEMICAL ENGINEERING JOURNAL,336,92-101. |
MLA | Xiao, Kui,et al."Atmospheric corrosion factors of printed circuit boards in a dry-heat desert environment: Salty dust and diurnal temperature difference".CHEMICAL ENGINEERING JOURNAL 336(2018):92-101. |
入库方式: OAI收割
来源:宁波材料技术与工程研究所
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