Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction
文献类型：期刊论文
| 作者 | Jiang, J. J.; Hu, F. Q.; Zhang, Q. K.; Song, Z. L. |
| 刊名 | MATERIALS LETTERS
 |
| 出版日期 | 2018 |
| 卷号 | 214页码:142-145 |
| 关键词 | Mechanical-properties Alloying Substrate Tensile Properties Bi Segregation Joints Embrittlement Temperature Melt |
| 英文摘要 | In this study, the influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction and fracture behavior of the aged SnBiAg/Cu solder joints were investigated. The results reveal that the Ag element in the solder can diffuse into the Cu substrate during the soldering and aging process, forming a Cu-Ag alloy layer around the joint interface. The Bi segregation was not observed at the aged SnBiAg/Cu interface, and the embrittlement will not occur at the aged SnBiAg/Cu solder joints once the Bi segregation was restrained. (C) 2017 Elsevier B.V. All rights reserved. |
| 学科主题 | Physics |
| 语种 | 英语 |
| 公开日期 | 2018-12-04 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/16791]  |
| 专题 | 2018专题 |
| 推荐引用方式 GB/T 7714 | Jiang, J. J.,Hu, F. Q.,Zhang, Q. K.,et al. Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction[J]. MATERIALS LETTERS,2018,214:142-145. |
| APA | Jiang, J. J.,Hu, F. Q.,Zhang, Q. K.,&Song, Z. L..(2018).Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction.MATERIALS LETTERS,214,142-145. |
| MLA | Jiang, J. J.,et al."Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction".MATERIALS LETTERS 214(2018):142-145. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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