Microfabrication of conductive copper patterns by meniscus-confined electrodeposition
文献类型：期刊论文
| 作者 | Gao, Fangpu; Lei, Yu; Guo, Jianjun; Xu, Gaojie; Yang, Yitao |
| 刊名 | INTEGRATED FERROELECTRICS
 |
| 出版日期 | 2018 |
| 卷号 | 190期号:1页码:164-172 |
| 关键词 | Fabrication Electrolyte Microscope Probe Wire |
| 英文摘要 | Complex three-dimensional copper (Cu) wires have been successfully fabricated by meniscus-confined electrodeposition (MCED) controlled by quasi-static stability of the meniscus. Here, we report a new dynamic meniscus stability based MCED process. The obtained copper microwires are straight, uniform in width and have a smooth surface (surface finish of 8.79nm (Ra)). When current density higher than 31.81 mA/cm(2), dense Cu microstructure is deposited on the cathode substrate, while current density between 12.13 mA/cm(2) and 31.81 mA/cm(2), sparsity structure was observed on the surface of the copper wire. This work provides a direct method to fabricate Cu microwires on conductive substrates without the use of additives. |
| 学科主题 | Engineering |
| 语种 | 英语 |
| 公开日期 | 2018-12-04 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/16891]  |
| 专题 | 2018专题 |
| 推荐引用方式 GB/T 7714 | Gao, Fangpu,Lei, Yu,Guo, Jianjun,et al. Microfabrication of conductive copper patterns by meniscus-confined electrodeposition[J]. INTEGRATED FERROELECTRICS,2018,190(1):164-172. |
| APA | Gao, Fangpu,Lei, Yu,Guo, Jianjun,Xu, Gaojie,&Yang, Yitao.(2018).Microfabrication of conductive copper patterns by meniscus-confined electrodeposition.INTEGRATED FERROELECTRICS,190(1),164-172. |
| MLA | Gao, Fangpu,et al."Microfabrication of conductive copper patterns by meniscus-confined electrodeposition".INTEGRATED FERROELECTRICS 190.1(2018):164-172. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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