Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO
文献类型：期刊论文
| 作者 | Lin, Cheng-Te; Guo, Liangchao; Zhang, Zhenyu; Kang, Ruiyang; Chen, Yapeng; Hou, Xiao; Wu, Yuming; Wang, Mengjie; Wang, Bo; Cui, Junfeng |
| 刊名 | RSC ADVANCES
 |
| 出版日期 | 2018 |
| 卷号 | 8期号:22页码:12337-12343 |
| 关键词 | Phenol-formaldehyde Composites Polymer Composites Mechanical-properties Nanocomposites Performance Whiskers Morphologies Dependence Expansion Resin |
| 英文摘要 | Epoxy composites with ZnO powders characterized by different structures as inclusion are prepared and their thermal properties are studied. The experimental results demonstrate that the epoxy resins filled by tetrapod-shaped ZnO (T-ZnO) whiskers have the superior thermal transport property in comparison to ZnO micron particles (ZnO MPs). The thermal conductivity of ZnO/epoxy and T-ZnO/epoxy composites in different mass fraction (10, 20, 30, 40, 50 wt%) are respectively investigated and the suitable models are compared to explain the enhancement effect of thermal conductivity. The thermal conductivity of TZnO/epoxy composites with 50 wt% filler reaches 4.38 W m(-1) K-1, approximately 1816% enhancement as compared to neat epoxy. In contrast, the same mass fraction of ZnO MPs are incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is because T-ZnO whiskers act as a thermal conductance bridge in the epoxy matrix. In addition, the other thermal properties of T-ZnO/epoxy composites are also improved. Furthermore, the T-ZnO/epoxy composite also presents a much reduced coefficient of thermal expansion (similar to 28.1 ppm K-1) and increased glass transition temperature (215.7 degrees C). This strategy meets the requirement for the rapid development of advanced electronic packaging. |
| 学科主题 | Chemistry |
| 语种 | 英语 |
| 公开日期 | 2018-12-04 |
| 源URL | [http://ir.nimte.ac.cn/handle/174433/16908]  |
| 专题 | 2018专题 |
| 推荐引用方式 GB/T 7714 | Lin, Cheng-Te,Guo, Liangchao,Zhang, Zhenyu,et al. Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO[J]. RSC ADVANCES,2018,8(22):12337-12343. |
| APA | Lin, Cheng-Te.,Guo, Liangchao.,Zhang, Zhenyu.,Kang, Ruiyang.,Chen, Yapeng.,...&Yu, Jinhong.(2018).Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO.RSC ADVANCES,8(22),12337-12343. |
| MLA | Lin, Cheng-Te,et al."Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO".RSC ADVANCES 8.22(2018):12337-12343. |
入库方式： OAI收割
来源：宁波材料技术与工程研究所
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