An introduction of resistive arrays and packaging technology
文献类型：会议论文
| 作者 | Sun Q; Liu DF; Gong HM |
| 出版日期 | 2017 |
| 关键词 | Resistor arrays Packaging technology Infrared scene simulation |
| DOI | 10.1117/12.2285546 |
| 英文摘要 | As an important way to simulate the dynamic infrared scene the technology of resistive arrays especially large format resistive arrays are developing very fast. Principle of resistive arrays is introduced. The unit cell is composed by two MOS transistors a capacitor and a resistor. The resistor is the main element to make infrared radiation by heating. Key parameters such as temperature frame rate uniformity and cross-talk are used to standard to evaluate the performance of the arrays. Several methods to improve the parameters is put forward. In addition development and current situation of the packaging technology is discussed and analyzed in this paper. At last the technology developments of resistive arrays and packaging are summed up and an outlook of the future is provided. |
| 语种 | 英语 |
| 源URL | [http://202.127.2.71:8080/handle/181331/12080]  |
| 专题 | 上海技术物理研究所_上海技物所 |
| 作者单位 | Shanghai Inst Tech Phys |
| 推荐引用方式 GB/T 7714 | Sun Q,Liu DF,Gong HM. An introduction of resistive arrays and packaging technology[C]. 见:. |
入库方式： OAI收割
来源：上海技术物理研究所
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