Life Test of the InGaAs Focal Plane Arrays Detector for Space Applications
文献类型：会议论文
| 作者 | Zhu XL; Zhang HY; Li X; Huang ZC; Gong HM |
| 出版日期 | 2017 |
| DOI | 10.1117/12.2273591 |
| 英文摘要 | The short-wavelength infrared (SWIR) InGaAs focal plane array (FPA) detector consists of infrared detector chip readout integrated circuit (ROIC) and flip-chip bonding interconnection by Indium bump. In order to satisfy space application requirements for failure rates or Mean Time to Failure (MTTF) which can only be demonstrated with the large number of detectors manufactured the single pixel in InGaAs FPAs was chosen as the research object in this paper. The constant-stress accelerated life tests were carried out at 70 degrees C 80 degrees C 90 degrees C and 100 degrees C. The failed pixels increased gradually during more than 14000 hours at each elevated temperatures. From the random failure data the activation energy was estimated to be 0.46eV and the average lifetime of a single pixel in InGaAs FPAs was estimated to be longer than 1E+7h at the practical operating temperature (5 degrees C). |
| 语种 | 英语 |
| 源URL | [http://202.127.2.71:8080/handle/181331/12094]  |
| 专题 | 上海技术物理研究所_上海技物所 |
| 作者单位 | Shanghai Inst Tech Phys |
| 推荐引用方式 GB/T 7714 | Zhu XL,Zhang HY,Li X,et al. Life Test of the InGaAs Focal Plane Arrays Detector for Space Applications[C]. 见:. |
入库方式： OAI收割
来源：上海技术物理研究所
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