Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point
文献类型：会议论文
| 作者 | Zhao ZL; Mo DF; Wu JR; Jiang MD; Zhang JL; Xu L |
| 出版日期 | 2017 |
| 关键词 | Wire bonding Bonding parameter Quality evaluation |
| DOI | 10.1117/12.2285650 |
| 英文摘要 | Wire bonding is one of the most widely used methods in the field of electrical connecting in packaging. The main characteristics of common wire bonding materials and process parameters affecting the reliability of wire bonding are discussed and analyzed. The evaluation method of wire bonding quality is described and the measures to enhance the reliability of wire bonding are put forward. The results show that of all the wire materials gold wire (Au) has the best comprehensive performance which used most widely. Aluminum wire (Al) and copper wire (Cu) are ideal materials for the replacement of Au because of low cost. Platinum wire (Pt) is mainly used in low temperature packaging for its low heat loss. In terms of bonding process parameters bonding force is an important parameter for the shape and strength of bonding point. Adjusting the bonding force is an effective method to solve the problem of pad damage and bonding interface slip. Ultrasonic power and time are the important factors affecting bonding strength. Usually it is easier to bond wires with higher bonding temperature and appropriate temperature is exist due to the device's tolerance temperature. In the wire bonding quality evaluation methods microscopic observation is the simplest method to evaluate the bonding quality. The mechanical testing methods include wire pull test and ball shear test. Environmental tests include temperature cycling electromagnetic resonance test and other testing. It is mainly used to evaluate the overall performance and fatigue properties of wire bonding. As a result the mechanical testing and environmental testing are the effective methods to adjust the new bonding process and microscopic inspection is an effective method for bonding quality assurance. |
| 语种 | 英语 |
| 源URL | [http://202.127.2.71:8080/handle/181331/12101]  |
| 专题 | 上海技术物理研究所_上海技物所 |
| 作者单位 | Shanghai Inst Tech Phys |
| 推荐引用方式 GB/T 7714 | Zhao ZL,Mo DF,Wu JR,et al. Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point[C]. 见:. |
入库方式： OAI收割
来源：上海技术物理研究所
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