Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure
文献类型：期刊论文
| 作者 | Zhang, Hui; Li, Jianfeng1; Dai, Jingru1; Corfield, Martin1; Liu, Xuejian; Liu, Yan; Huang, Zhengren; Johnson, Christopher Mark1 |
| 刊名 | IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS
 |
| 出版日期 | 2018 |
| 卷号 | 6期号:1页码:175 |
| 关键词 | Electronic packaging finite-element (FE) method material reliability planar power module power cycling X-ray computation tomography |
| ISSN号 | 2168-6777 |
| DOI | 10.1109/JESTPE.2017.2758901 |
| 英文摘要 | This paper proposes an advanced Si3N4 ceramic-based structure with through vias designed and filled with brazing alloy as a reliable interconnect solution in planar power modules. Finite-element (FE) modeling and simulation were first used to predict the potential of using the proposed Si3N4 ceramic-based structure to improve the heat dissipation and reliability of planar interconnects. Power cycling tests and nondestructive microstructural characterization were then performed on Si3N4 ceramic-based structures, flexible printed circuit boards (PCBs), and conventional Al wire interconnect samples to evaluate the FE predictions. Both the FE simulations and experimental tests were carried out on single Si diode samples where both the ceramic-based structures and flexible PCBs were bonded on the top sides of Si diodes with eutectic Sn-3.5Ag solder joints. The results obtained demonstrate that Si3N4 ceramic-based structures can significantly improve the reliability of planar interconnects. The experimental average lifetimes and FE simulated maximum creep strain accumulations for the ceramic-based structure and flexible PCB interconnect samples can reasonably be fitted to existing lifetime models for Sn-3.5Ag solder joints. Discrepancies between the models and experimental results can be attributed to defects and poor filling of the brazing alloy in the vias through the Si3N4 ceramic. |
| 学科主题 | Engineering, Electrical & Electronic |
| WOS记录号 | WOS:000424079000015 |
| 出版者 | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
| 资助机构 | This work was supported by the Engineering and Physical Sciences Research Council, U.K., through the Centre for Power Electronics (grants for the hub and components theme), under Grant EP/K035304/1 and Grant EP/K034804/1. Recommended for publication by Associate Editor Ron Hui. (Corresponding author: Jianfeng Li.) ; This work was supported by the Engineering and Physical Sciences Research Council, U.K., through the Centre for Power Electronics (grants for the hub and components theme), under Grant EP/K035304/1 and Grant EP/K034804/1. Recommended for publication by Associate Editor Ron Hui. (Corresponding author: Jianfeng Li.) |
| 源URL | [http://ir.sic.ac.cn/handle/331005/24452]  |
| 专题 | 中国科学院上海硅酸盐研究所 |
| 作者单位 | 1.Chinese Acad Sci, Shanghai Inst Ceram, Shanghai 201899, Peoples R China 2.Univ Nottingham, Dept Elect & Elect Engn, Nottingham NG7 2RD, England |
| 推荐引用方式 GB/T 7714 | Zhang, Hui,Li, Jianfeng,Dai, Jingru,et al. Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure[J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS,2018,6(1):175, 187. |
| APA | Zhang, Hui.,Li, Jianfeng.,Dai, Jingru.,Corfield, Martin.,Liu, Xuejian.,...&Johnson, Christopher Mark.(2018).Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure.IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS,6(1),175. |
| MLA | Zhang, Hui,et al."Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure".IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS 6.1(2018):175. |
入库方式： OAI收割
来源：上海硅酸盐研究所
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