Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment
文献类型：期刊论文
| 作者 | Xu, HY; Li, JQ; Ning, PQ; Xu, J; Xu, Hongyan; Li, Jianqiang; Ning, Puqi; Xu, Ju |
| 刊名 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
 |
| 出版日期 | 2018 |
| 页码 | 1709 |
| 关键词 | microstructure evolution PHASE as-reflowed SOLDER aging test SILVER temperature cycling shearing strength |
| 文献子类 | Proceedings Paper |
| 英文摘要 | The microstructure and properties of Cu@Cu3Sn@Cu6Sn5three-dimensional network bonding interconnections based on Cu@Sn preform was investigated. No through holes were observed at the bulk in as-reflowed, aged and temperature cycling bondlines. Microstructure evolution and phase transformation during thermal treatment test were studied, the shear strength of three-dimensional network bondlines for as-reflowed and thermal treating samples were compared and analyzed. The phase composition of as-reflowed interconnects was Cu/Cu6Sn5 and transformed to Cu/Cu3Sn/Cu6Sn5 after thermal treatment. Different failure modes of as-reflowed, aged and temperature cycling test were found in three-dimensional network structure bondline. The average shear strength of the as-reflowed and the thermal treatment bonding interconnections are 49.5 MPa and 24.9 MPa, respectively, and crack initiated and propagated that perpendicular to substrate during the aging test. The fracture surfaces of the temperature treatment bonding interconnections after shearing test were characterized in detail. The results show that the Cu3Sn phases in Cu@Cu3Sn@Cu6Sn5 three-dimensional network structure affected its strength and fracture mode. The Cu-rich substrate side at the fracture surfaces is always regular while the bulk phases are often accompanied by shear bands and dimples. |
| WOS记录号 | WOS:000450155700375 |
| 资助机构 | National Nature Science Foundation of China [51777203] ; National key research & develop plan "New energy vehicles special project" [2016YFBO 100600] |
| 源URL | [http://ir.ipe.ac.cn/handle/122111/26807]  |
| 专题 | 中国科学院过程工程研究所 |
| 推荐引用方式 GB/T 7714 | Xu, HY,Li, JQ,Ning, PQ,et al. Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment[J]. 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),2018:1709, 1715. |
| APA | Xu, HY.,Li, JQ.,Ning, PQ.,Xu, J.,Xu, Hongyan.,...&Xu, Ju.(2018).Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment.2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),1709. |
| MLA | Xu, HY,et al."Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment".2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) (2018):1709. |
入库方式： OAI收割
来源：过程工程研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。