Analysis and Modeling of Thermal-Electric Coupling Effect of High-Power Monolithically Integrated Light-Emitting Diode
文献类型：期刊论文
| 作者 | Huang, Hongjuan(黄宏娟) ; Zhang, Baoshun(张宝顺); Cai, Yong(蔡勇); Zhang, Yibin(张亦斌); Ding, Mingdi(丁明迪); Zhao, Desheng(赵德胜); Huang, Longjie; Lin, Yunzhen; Bian, Difei
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| 刊名 | IEEE TRANSACTIONS ON ELECTRON DEVICES
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| 出版日期 | 2018 |
| 其他题名 | Analysis and Modeling of Thermal-Electric Coupling Effect of High-Power Monolithically Integrated Light-Emitting Diode |
| 语种 | 英语 |
| 源URL | [http://ir.sinano.ac.cn/handle/332007/6194]  |
| 专题 | 苏州纳米技术与纳米仿生研究所_纳米器件及相关材料研究部_张宝顺团队 |
| 作者单位 | 中国科学院苏州纳米技术与纳米仿生研究所 |
| 推荐引用方式 GB/T 7714 | Huang, Hongjuan,Zhang, Baoshun,Cai, Yong,et al. Analysis and Modeling of Thermal-Electric Coupling Effect of High-Power Monolithically Integrated Light-Emitting Diode[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES,2018. |
| APA | Huang, Hongjuan.,Zhang, Baoshun.,Cai, Yong.,Zhang, Yibin.,Ding, Mingdi.,...&Bian, Difei.(2018).Analysis and Modeling of Thermal-Electric Coupling Effect of High-Power Monolithically Integrated Light-Emitting Diode.IEEE TRANSACTIONS ON ELECTRON DEVICES. |
| MLA | Huang, Hongjuan,et al."Analysis and Modeling of Thermal-Electric Coupling Effect of High-Power Monolithically Integrated Light-Emitting Diode".IEEE TRANSACTIONS ON ELECTRON DEVICES (2018). |
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