中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Integrated electrochemical analysis of polyvinylpyrrolidone(PVP) as the inhibitor for copper chemical mechanical planarization(Cu-CMP)

文献类型:期刊论文

作者GuangYang; HaixuWang; NingWang; RongSuna; Ching-PingWong
刊名Journal of Alloys and Compounds
出版日期2019
文献子类期刊论文
英文摘要Copper chemical mechanical planarization (Cu-CMP) is an essential procedure for the fabrication of integrated circuits (IC). The corrosion inhibitors in the Cu-CMP slurry could balance the over etching from the corrosion reagents to facilitate the global planarization of the copper layers. However, the normally used Cu-CMP inhibitor 1-benzotriazole (BTA) was toxic for the long time usage. In this paper, the biocompatible polyvinyl pyrrolidone (PVP) was proposed to substitute the BTA in the Cu-CMP. With an integrated electrochemical test, including the Tafel polarization, electrochemical impedance spectra (EIS), and the electrochemical noise (EN), it was found that the PVP could possess a good inhibition effect comparable to BTA, whichopenedupapromisingwayforthedesignofbiocompatibleinhibitorsintheCu-CMP
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语种英语
源URL[http://ir.siat.ac.cn:8080/handle/172644/13643]  
专题深圳先进技术研究院_集成所
推荐引用方式
GB/T 7714
GuangYang,HaixuWang,NingWang,等. Integrated electrochemical analysis of polyvinylpyrrolidone(PVP) as the inhibitor for copper chemical mechanical planarization(Cu-CMP)[J]. Journal of Alloys and Compounds,2019.
APA GuangYang,HaixuWang,NingWang,RongSuna,&Ching-PingWong.(2019).Integrated electrochemical analysis of polyvinylpyrrolidone(PVP) as the inhibitor for copper chemical mechanical planarization(Cu-CMP).Journal of Alloys and Compounds.
MLA GuangYang,et al."Integrated electrochemical analysis of polyvinylpyrrolidone(PVP) as the inhibitor for copper chemical mechanical planarization(Cu-CMP)".Journal of Alloys and Compounds (2019).

入库方式: OAI收割

来源:深圳先进技术研究院

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