Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon
文献类型：期刊论文
| 作者 | Tang QH(汤奇恒)
|
| 刊名 | Materials Science In Semiconductor Processing
 |
| 出版日期 | 2007 |
| 页码 | 270-275 |
| 通讯作者邮箱 | qhtang@lnm.imech.ac.cn |
| 关键词 | Molecular Dynamics Simulation Atomic Force Microscopy Silicon Dislocation Pin Tool Atomic-Force Microscopy Molecular-Dynamics Simulation Phase-Transformations Shuffle Dislocations Nano-Indentation Monocrystals Surface Si Deformation Fracture |
| ISSN号 | 1369-8001 |
| 通讯作者 | Tang, QH (reprint author), Chinese Acad Sci, Inst Mech, State Key Lab Nonlinear Mech, Beijing 100080, Peoples R China. |
| 中文摘要 | By means of Tersoff and Morse potentials, a three-dimensional molecular dynamics simulation is performed to study atomic force microscopy cutting on silicon monocrystal surface. The interatomic forces between the workpiece and the pin tool and the atoms of workpiece themselves are simulated. Two partial edge dislocations are introduced into workpiece Si, it is found that the motion of dislocations does not occur during the atomic force microscopy cutting processing. Simulation results show that the shear stress acting on dislocations is far below the yield strength of Si. (c) 2008 Elsevier Ltd. All rights reserved. |
| 类目[WOS] | Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter |
| 研究领域[WOS] | Engineering ; Materials Science ; Physics |
| 关键词[WOS] | ATOMIC-FORCE MICROSCOPY ; MOLECULAR-DYNAMICS SIMULATION ; PHASE-TRANSFORMATIONS ; SHUFFLE DISLOCATIONS ; NANO-INDENTATION ; MONOCRYSTALS ; SURFACE ; SI ; DEFORMATION ; FRACTURE |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000257894800008 |
| 公开日期 | 2009-08-03 ; 2009-09-14 |
| 源URL | [http://dspace.imech.ac.cn/handle/311007/25496]  |
| 专题 | 力学研究所_力学所知识产出(1956-2008) |
| 推荐引用方式 GB/T 7714 | Tang QH. Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon[J]. Materials Science In Semiconductor Processing,2007:270-275. |
| APA | 汤奇恒.(2007).Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon.Materials Science In Semiconductor Processing,270-275. |
| MLA | 汤奇恒."Md Simulation Of Dislocation Mobility During Cutting With Diamond Tip On Silicon".Materials Science In Semiconductor Processing (2007):270-275. |
入库方式： OAI收割
来源：力学研究所
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