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Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites

文献类型：期刊论文

作者Xue, Yang1,2; Li, Xiaofei1,2; Wang, Haosheng2; Zhao, Feng1,2; Zhang, Donghai2; Chen, Yunfa2,3
刊名MATERIALS & DESIGN
出版日期2019-03-05
卷号165页码:8
关键词Vertically aligned-BN Through-plane thermal conductivity SR composites Interface thermal resistance Mechanical orientation
ISSN号0264-1275
DOI10.1016/j.matdes.2018.107580
英文摘要Effective heat dissipation has become a critical issue for electronic devices. In this study, the silicone rubber (SR)/vertically aligned boron nitride (BN) composites were prepared and the thermal conductivity of the composites was systematically investigated. The vertically aligned BNs constructed effective vertical thermal conductive pathways in the SR matrix, and the SR/ABN composites exhibited much higher through-plane thermal conductivity compared to the non-orientated SR/BN composite. The through-plane thermal conductivity of SR/ABN150 reached 5.4 W m(-1) K-1, which was similar to 6.3 and similar to 33 times higher than those of SR/BN150 and pure SR, respectively. In addition, the surface thermal infrared analysis also indicates that the vertically aligned SR/ABN composites possess excellent heat transfer capacity during the heating and cooling processes. The obtained results exhibit the potential for the design and preparation of thermal interface materials (TIMs) with high through-plane thermal conductivity to be applied in thermal conductive and electrical insulating field. (C) 2019 Elsevier Ltd.
WOS关键词POLYMER-BASED COMPOSITES ; NITRIDE NANOSHEETS ; COLD-PLASMA ; ENHANCEMENT ; BN ; NANOCOMPOSITES ; FABRICATION ; FILLERS ; FOAM
资助项目National Key R&D Program of China[2016YFC0204600] ; Strategic Priority Research Program of the Chinese Academy of Sciences[XDA09030202]
WOS研究方向Materials Science
语种英语
WOS记录号WOS:000458259300010
出版者ELSEVIER SCI LTD
资助机构National Key R&D Program of China ; Strategic Priority Research Program of the Chinese Academy of Sciences
源URL[http://ir.ipe.ac.cn/handle/122111/27897]  
专题中国科学院过程工程研究所
通讯作者Chen, Yunfa
作者单位1.Univ Chinese Acad Sci, Beijing 100049, Peoples R China
2.Chinese Acad Sci, Inst Proc Engn, China State Key Lab Multiphase Complex Syst, Beijing 100190, Peoples R China
3.Chinese Acad Sci, Inst Urban Environm, Ctr Excellence Reg Atmospher Environm, Xiamen 361021, Peoples R China
推荐引用方式
GB/T 7714		 Xue, Yang,Li, Xiaofei,Wang, Haosheng,et al. Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites[J]. MATERIALS & DESIGN,2019,165:8.
APA Xue, Yang,Li, Xiaofei,Wang, Haosheng,Zhao, Feng,Zhang, Donghai,&Chen, Yunfa.(2019).Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites.MATERIALS & DESIGN,165,8.
MLA Xue, Yang,et al."Improvement in thermal conductivity of through-plane aligned boron nitride/silicone rubber composites".MATERIALS & DESIGN 165(2019):8.

入库方式： OAI收割

来源：过程工程研究所

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