Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of gaas ccd
文献类型：期刊论文
| 作者 | Ye, Jiaotuo1,2; Wang, Shuangfu1,2; Zhu, Chunsheng1,2; Xu, Gaowei1; Luo, Le1 |
| 刊名 | Microsystem technologies-micro-and nanosystems-information storage and processing systems
 |
| 出版日期 | 2016-08-01 |
| 卷号 | 22期号:8页码:1983-1989 |
| ISSN号 | 0946-7076 |
| DOI | 10.1007/s00542-015-2507-6 |
| 通讯作者 | Luo, le(leluo@mail.sim.ac.cn) |
| 英文摘要 | This paper presents a novel combined through-wafer-groove fabrication approach, which is applied to the wafer level packaging (wlp) of gaas charge coupled devices (ccd) for electrical interconnection. the combined methodology includes mechanical dicing of the groove and wet chemical etching for polishing. the parameters of the mechanical dicing are researched, including feed speed, dicing directions of the wafer, and cutting depth, to minimize the chipping. two kinds of chemical solution are tried, and the results are discussed. besides, the etch rate is measured, which provides a guideline for the process design. finally, gaas-ccd wlp sample is achieved and the electrical properties are tested to validate the feasibility of this fabrication approach. this methodology is featured by low cost, low process temperature, and good process uniformity. |
| WOS关键词 | SILICON |
| WOS研究方向 | Engineering ; Science & Technology - Other Topics ; Materials Science ; Physics |
| WOS类目 | Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Physics, Applied |
| 语种 | 英语 |
| WOS记录号 | WOS:000380121700006 |
| 出版者 | SPRINGER |
| URI标识 | http://www.irgrid.ac.cn/handle/1471x/2374484 |
| 专题 | 中国科学院大学 |
| 通讯作者 | Luo, Le |
| 作者单位 | 1.Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Labs Transducer Technol, Shanghai 200050, Peoples R China 2.Chinese Acad Sci, Grad Univ, Beijing 100049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Ye, Jiaotuo,Wang, Shuangfu,Zhu, Chunsheng,et al. Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of gaas ccd[J]. Microsystem technologies-micro-and nanosystems-information storage and processing systems,2016,22(8):1983-1989. |
| APA | Ye, Jiaotuo,Wang, Shuangfu,Zhu, Chunsheng,Xu, Gaowei,&Luo, Le.(2016).Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of gaas ccd.Microsystem technologies-micro-and nanosystems-information storage and processing systems,22(8),1983-1989. |
| MLA | Ye, Jiaotuo,et al."Novel combined through-wafer-groove fabrication approach and its application in wafer level packaging of gaas ccd".Microsystem technologies-micro-and nanosystems-information storage and processing systems 22.8(2016):1983-1989. |
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来源：中国科学院大学
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